Part Details for AS4C256M16D3LC-10BINTR by Alliance Memory Inc
Overview of AS4C256M16D3LC-10BINTR by Alliance Memory Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for AS4C256M16D3LC-10BINTR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK6921
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Newark | Ddr3, 4G, 256M X 16, 1.35V, 96-Ball Fbga, 933Mhz, Industrial Temp, Tape And Reel |Alliance Memory AS4C256M16D3LC-10BINTR Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$11.1000 / $11.9000 | Buy Now |
DISTI #
1450-AS4C256M16D3LC-10BINCT-ND
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DigiKey | 256M X 16, 1.35V, 933MHZ, DDR3-1 Min Qty: 1 Lead time: 8 Weeks Container: Cut Tape (CT), Tape & Reel (TR), Digi-Reel® | Temporarily Out of Stock |
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$7.9353 / $11.4900 | Buy Now |
DISTI #
AS4C256M16D3LC-10BINTR
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Avnet Americas | DRAM Chip DDR3L SDRAM 4G-bit 256Mx16 1.35V/1.5V 96-Pin FBGA T/R - Tape and Reel (Alt: AS4C256M16D3LC-10BINTR) Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks, 0 Days Container: Reel | 7000 Factory Stock |
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$10.7100 | Buy Now |
DISTI #
913-256M16D3L10BINTR
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Mouser Electronics | DRAM DDR3, 4G, 256M X 16, 1.35V, 96-BALL FBGA, 933MHZ, Industrial Temp - Tape & Reel RoHS: Compliant | 0 |
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$7.1900 / $11.1500 | Order Now |
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Karl Kruse GmbH & Co KG | DDR3 4G 256M X 16 1.35V 96-BALL FBGA 933MHZ Industrial Temp Tape and Reel | 27500 |
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RFQ | |
DISTI #
AS4C256M16D3LC-10BINTR
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Avnet Silica | DRAM Chip DDR3L SDRAM 4G-bit 256Mx16 1.35V/1.5V 96-Pin FBGA T/R (Alt: AS4C256M16D3LC-10BINTR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 9 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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New Advantage Corporation | 256M X 16, 1.35V, 933MHZ, DDR3-1 RoHS: Compliant Min Qty: 1 Package Multiple: 100 | 1586 |
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$11.9000 / $12.7400 | Buy Now |
Part Details for AS4C256M16D3LC-10BINTR
AS4C256M16D3LC-10BINTR CAD Models
AS4C256M16D3LC-10BINTR Part Data Attributes
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AS4C256M16D3LC-10BINTR
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C256M16D3LC-10BINTR
Alliance Memory Inc
DDR DRAM,
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | FBGA-96 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Alliance Memory | |
Access Mode | MULTI BANK PAGE BURST | |
Clock Frequency-Max (fCLK) | 933 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B96 | |
JESD-609 Code | e1 | |
Length | 13.5 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA96,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.008 A | |
Supply Current-Max | 0.242 mA | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.5 mm |