Part Details for AS4C256M16D3C-12BINTR by Alliance Memory Inc
Overview of AS4C256M16D3C-12BINTR by Alliance Memory Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for AS4C256M16D3C-12BINTR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK6916
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Newark | Ddr3, 4G, 256M X 16, 1.5V, 96-Ball Fbga, 800Mhz, Industrial Temp , Tape And Reel |Alliance Memory AS4C256M16D3C-12BINTR Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$11.1000 / $11.9000 | Buy Now |
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DISTI #
1450-AS4C256M16D3C-12BINCT-ND
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DigiKey | IC DRAM 4GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 6 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
8827 In Stock |
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$7.9353 / $11.4900 | Buy Now |
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DISTI #
AS4C256M16D3C-12BINTR
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Avnet Americas | DRAM Chip DDR3L SDRAM 4G-bit 256Mx16 1.35V/1.5V 96-Pin FBGA T/R - Tape and Reel (Alt: AS4C256M16D3C-12BINTR) Min Qty: 2500 Package Multiple: 2500 Lead time: 6 Weeks, 0 Days Container: Reel | 15000 Factory Stock |
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$10.7100 | Buy Now |
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DISTI #
913-256M16D312BINTR
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Mouser Electronics | DRAM DDR3, 4G, 256M x 16, 1.5V, 96-ball FBGA, 800MHz, Industrial Temp - Tape & Reel RoHS: Compliant | 0 |
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$7.7000 | Order Now |
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Future Electronics | AS4C256Mx Series 4 Gb (256 Mb x 16) DDR3, 1.5V 800 MHz SynchDRAM - FBGA-96 C die RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 6 Weeks Container: Reel | 0Reel |
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$7.5500 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3 4G 256M x 16 1.5V 96-ball FBGA 800MHz Industrial Temp Tape and Reel | 17500 |
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RFQ | |
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DISTI #
ICDRAM2279
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Rutronik | DDR3 SDRAM 4Gb 256Mx16 800MHz RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Container: Reel |
Stock DE - 2500 Stock HK - 0 Stock US - 0 Stock SG - 0 |
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$10.6600 | Buy Now |
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DISTI #
AS4C256M16D3C-12BINTR
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Avnet Silica | (Alt: AS4C256M16D3C-12BINTR) RoHS: Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 7 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for AS4C256M16D3C-12BINTR
AS4C256M16D3C-12BINTR CAD Models
AS4C256M16D3C-12BINTR Part Data Attributes
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AS4C256M16D3C-12BINTR
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C256M16D3C-12BINTR
Alliance Memory Inc
DDR DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 6 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Supply Current-Max | 0.19 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.5 mm |