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Part Details for AS4C256M16D3C-10BIN by Alliance Memory Inc
Overview of AS4C256M16D3C-10BIN by Alliance Memory Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for AS4C256M16D3C-10BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK6913
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Newark | Ddr3, 4G, 256M X 16, 1.5V, 96-Ball Fbga, 933Mhz, Industrial Temp |Alliance Memory AS4C256M16D3C-10BIN Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$11.0000 / $11.8000 | Buy Now |
|
DISTI #
1450-AS4C256M16D3C-10BIN-ND
|
DigiKey | IC DRAM 4GBIT PAR 96FBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
153 In Stock |
|
$8.2123 / $11.3900 | Buy Now |
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DISTI #
AS4C256M16D3C-10BIN
|
Avnet Americas | DRAM Chip DDR3L SDRAM 4G-bit 256Mx16 1.35V/1.5V 96-Pin FBGA Tray - Trays (Alt: AS4C256M16D3C-10BIN) Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks, 0 Days Container: Tray | 9945 Factory Stock |
|
$10.6200 | Buy Now |
|
DISTI #
913-4C256M16D310BIN
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Mouser Electronics | DRAM DDR3, 4G, 256M x 16, 1.5V, 96-ball FBGA, 933MHz, Industrial Temp - Tray RoHS: Compliant | 224 |
|
$7.9300 / $11.0600 | Buy Now |
|
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks Container: Tray | 0Tray |
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$7.3800 | Buy Now |
|
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Karl Kruse GmbH & Co KG | DDR3 4G 256M x 16 1.5V 96-ball FBGA 933MHz Industrial Temp | 9945 |
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RFQ | |
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DISTI #
AS4C256M16D3C-10BIN
|
Avnet Silica | (Alt: AS4C256M16D3C-10BIN) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 7 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for AS4C256M16D3C-10BIN
AS4C256M16D3C-10BIN CAD Models
AS4C256M16D3C-10BIN Part Data Attributes
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AS4C256M16D3C-10BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C256M16D3C-10BIN
Alliance Memory Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 6 Weeks | |
| Date Of Intro | 2020-03-26 | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 933 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| JESD-609 Code | e1 | |
| Length | 13.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.008 A | |
| Standby Voltage-Min | 1.425 V | |
| Supply Current-Max | 0.2 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.5 mm |