Part Details for AS4C16M16D1-5BCN by Alliance Memory Inc
Overview of AS4C16M16D1-5BCN by Alliance Memory Inc
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for AS4C16M16D1-5BCN
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
82AK9842
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Newark | Dram, 256Mbit, 200Mhz, Tfbga-60 Rohs Compliant: Yes |Alliance Memory AS4C16M16D1-5BCN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 240 |
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$3.6700 / $5.6100 | Buy Now |
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DISTI #
82AK3779
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Newark | Dram, 256Mbit, 200Mhz, Tfbga-60, Dram Type:Ddr1, Memory Configuration:16M X 16Bit, Clock Frequency Max:200Mhz, Ic Case/Package:Tfbga, No. Of Pins:60Pins, Supply Voltage Nom:2.5V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C16M16D1-5BCN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.7000 / $5.6600 | Buy Now |
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DISTI #
1450-1093-ND
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DigiKey | IC DRAM 256MBIT PAR 60TFBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
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$3.3639 / $4.6600 | Buy Now |
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DISTI #
AS4C16M16D1-5BCN
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 16M x 16 2.5V 60-Pin TFBGA - Trays (Alt: AS4C16M16D1-5BCN) RoHS: Not Compliant Min Qty: 240 Package Multiple: 240 Lead time: 20 Weeks, 0 Days Container: Tray | 17068 Factory Stock |
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$3.8700 | Buy Now |
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DISTI #
913-AS4C16M16D1-5BCN
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Mouser Electronics | DRAM DDR1, 256Mb, 16M x 16, 2.5V, 60 BGA, 200MHz, Commercial Temp - Tray RoHS: Compliant | 0 |
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$3.2600 / $4.5100 | Order Now |
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Future Electronics | AS4C16M16D1 Series 256Mb (16M x 16) 200MHz DDR Synchronous DRAM (SDRAM)-TFBGA-60 RoHS: Compliant pbFree: Yes Min Qty: 240 Package Multiple: 240 Container: Tray | 0Tray |
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$3.5000 | Buy Now |
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DISTI #
AS4C16M16D1-5BCN
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 16M x 16 2.5V 60-Pin TFBGA - Trays (Alt: AS4C16M16D1-5BCN) RoHS: Not Compliant Min Qty: 240 Package Multiple: 240 Lead time: 20 Weeks, 0 Days Container: Tray | 17068 Factory Stock |
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$3.8700 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR1 256Mb 16M x 16 2.5V BGA 200MHz Commercial Temp | 18143 |
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RFQ | |
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DISTI #
4260957
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element14 Asia-Pacific | DRAM, 256MBIT, 200MHZ, TFBGA-60 RoHS: Compliant Min Qty: 1 Container: Each | 240 |
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$3.2991 / $4.3618 | Buy Now |
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DISTI #
4260957
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Farnell | DRAM, 256MBIT, 200MHZ, TFBGA-60 RoHS: Compliant Min Qty: 1 Lead time: 21 Weeks, 1 Days Container: Each | 240 |
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$3.4137 / $4.6266 | Buy Now |
Part Details for AS4C16M16D1-5BCN
AS4C16M16D1-5BCN CAD Models
AS4C16M16D1-5BCN Part Data Attributes:
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AS4C16M16D1-5BCN
Alliance Memory Inc
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Datasheet
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Compare Parts:
AS4C16M16D1-5BCN
Alliance Memory Inc
Synchronous DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-60
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, TFBGA-60 | |
| Pin Count | 60 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Factory Lead Time | 20 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.7 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA60,9X12,40/32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.04 A | |
| Supply Current-Max | 0.235 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |