Part Details for AS4C128M16D3LC-12BIN by Alliance Memory Inc
Overview of AS4C128M16D3LC-12BIN by Alliance Memory Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for AS4C128M16D3LC-12BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
82AK3776
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Newark | Dram, 800Mhz, 2Gbit, Fbga-96, Dram Type:Ddr3, Memory Configuration:128M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.35V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C128M16D3LC-12BIN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 198 |
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$7.9200 / $12.1000 | Buy Now |
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DISTI #
1450-AS4C128M16D3LC-12BIN-ND
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DigiKey | IC DRAM 2GBIT 800MHZ 96FBGA Min Qty: 1 Lead time: 8 Weeks Container: Tray |
8617 In Stock |
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$6.6230 / $9.2400 | Buy Now |
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DISTI #
AS4C128M16D3LC-12B
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Avnet Americas | DRAM Chip DDR3L SDRAM 2 GB 128M x 16 1.35V 96-Pin FBGA Tray - Trays (Alt: AS4C128M16D3LC-12B) RoHS: Not Compliant Min Qty: 198 Package Multiple: 198 Lead time: 8 Weeks, 0 Days Container: Tray | 144367 Factory Stock |
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$8.2800 | Buy Now |
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DISTI #
913-128M16D3LC-12BIN
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Mouser Electronics | DRAM DDR3, 2G, 1.35V, 96-BALL FBGA, 800MHZ, INDUSTRIAL TEMP - Tray | 199 |
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$6.4200 / $8.9700 | Buy Now |
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Future Electronics | 2G DDR3L SDRAM (Synchronous DRAM) 96ball FBGA Package 128M x 16 bit RoHS: Compliant pbFree: Yes Min Qty: 198 Package Multiple: 198 Lead time: 8 Weeks Container: Tray | 0Tray |
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$6.8200 | Buy Now |
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Future Electronics | 2G DDR3L SDRAM (Synchronous DRAM) 96ball FBGA Package 128M x 16 bit RoHS: Compliant pbFree: Yes Min Qty: 198 Package Multiple: 198 Lead time: 8 Weeks Container: Tray | 0Tray |
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$6.9500 / $7.2700 | Buy Now |
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DISTI #
4C128M16D3LC-12BIN
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TME | IC: DRAM memory, 2GbDRAM, 128Mx16bit, 1.35V, 800MHz, 13.75ns Min Qty: 1 | 233 |
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$8.2700 / $11.7000 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3 2G 1.35V 96-BALL FBGA 800MHZ INDUSTRIAL TEMP | 149161 |
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RFQ | |
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DISTI #
AS4C128M16D3LC-12BIN
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Avnet Asia | DRAM Chip DDR3L SDRAM 2 GB 128M x 16 1.35V 96-Pin FBGA Tray (Alt: AS4C128M16D3LC-12BIN) RoHS: Compliant Min Qty: 396 Package Multiple: 198 Lead time: 8 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
AS4C128M16D3LC-12BIN
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Avnet Silica | DRAM Chip DDR3L SDRAM 2 GB 128M x 16 1.35V 96-Pin FBGA Tray (Alt: AS4C128M16D3LC-12BIN) RoHS: Compliant Min Qty: 198 Package Multiple: 198 Lead time: 9 Weeks, 0 Days | Silica - 10296 |
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Buy Now |
Part Details for AS4C128M16D3LC-12BIN
AS4C128M16D3LC-12BIN CAD Models
AS4C128M16D3LC-12BIN Part Data Attributes
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AS4C128M16D3LC-12BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C128M16D3LC-12BIN
Alliance Memory Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO REFRESH, SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.015 A | |
| Standby Voltage-Min | 1.283 V | |
| Supply Current-Max | 0.24 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 7.5 mm |
Alternate Parts for AS4C128M16D3LC-12BIN
This table gives cross-reference parts and alternative options found for AS4C128M16D3LC-12BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS4C128M16D3LC-12BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS4C128M16D3LC-12BCN | DRAM, | Alliance Memory Inc | AS4C128M16D3LC-12BIN vs AS4C128M16D3LC-12BCN |