Part Details for AS4C128M16D2A-25BIN by Alliance Memory Inc
Overview of AS4C128M16D2A-25BIN by Alliance Memory Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C128M16D2A-25BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK6825
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Newark | Ddr2, 2G, 128M X 16, 1.8V, 400 Mhz, 84Ball Fbga, Industrial Temp(A) |Alliance Memory AS4C128M16D2A-25BIN Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$15.2000 / $15.5000 | Buy Now |
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DISTI #
1450-1313-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 84FBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
302 In Stock |
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$11.0857 / $14.7500 | Buy Now |
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DISTI #
AS4C128M16D2A-25BI
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Avnet Americas | DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA - Trays (Alt: AS4C128M16D2A-25BI) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 12 Weeks, 0 Days Container: Tray | 5575 Factory Stock |
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$13.9500 | Buy Now |
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DISTI #
913-4C128M16D2A25BIN
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Mouser Electronics | DRAM DDR2, 2G, 128M x 16, 1.8V, 400 Mhz, 84ball FBGA, (A-die), Industrial Temp - Tray RoHS: Compliant | 904 |
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$10.7500 / $14.3200 | Buy Now |
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Future Electronics | AS4C128M16D2A Series 2 Gb (128 M x 16) 1.9 V 400 MHz DDR2 SDRAM - FBGA-84 RoHS: Compliant pbFree: Yes Min Qty: 2090 Package Multiple: 209 Lead time: 12 Weeks Container: Tray | 0Tray |
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$10.5400 | Buy Now |
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DISTI #
AS4C128M16D2A-25BI
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TME | IC: DRAM memory, 2GbDRAM, 128Mx16bit, 1.8V, 400MHz, 12.5ns, FBGA84 Min Qty: 1 | 0 |
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$10.7000 / $17.3000 | RFQ |
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Karl Kruse GmbH & Co KG | DDR2 2G 128M x 16 1.8V 400 Mhz 84ball FBGA Industrial Temp(A) | 9964 |
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RFQ | |
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DISTI #
ICDRAM1798
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Rutronik | DDR2 SDRAM 2Gb 128Mx16 400MHz RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray |
Stock DE - 139 Stock HK - 0 Stock US - 0 Stock SG - 0 |
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$10.5000 / $13.8600 | Buy Now |
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DISTI #
AS4C128M16D2A-25BIN
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Avnet Asia | DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA (Alt: AS4C128M16D2A-25BIN) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 12 Weeks, 0 Days | 0 |
|
RFQ | |
|
DISTI #
AS4C128M16D2A-25BIN
|
Avnet Silica | DRAM Chip DDR2 SDRAM 2Gb 128M x 16 1.8V 84-Pin TFBGA (Alt: AS4C128M16D2A-25BIN) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for AS4C128M16D2A-25BIN
AS4C128M16D2A-25BIN CAD Models
AS4C128M16D2A-25BIN Part Data Attributes
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AS4C128M16D2A-25BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C128M16D2A-25BIN
Alliance Memory Inc
DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA84, FBGA-84
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-84 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.016 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.33 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |