Part Details for AS4C128M16D2-25BIN by Alliance Memory Inc
Overview of AS4C128M16D2-25BIN by Alliance Memory Inc
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C128M16D2-25BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK6820
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Newark | Ddr2, 2G, 128M X 16, 1.8V, 400 Mhz, 84Ball Fbga, Industrial Temp |Alliance Memory AS4C128M16D2-25BIN Min Qty: 162 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$16.7000 / $17.0000 | Buy Now |
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DISTI #
1450-1081-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 84FBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
466 In Stock |
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$10.6250 / $11.0400 | Buy Now |
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DISTI #
AS4C128M16D2-25BIN
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Avnet Americas | DRAM Chip DDR2 SDRAM 2G-Bit 128M x 16 1.8V 84-Pin FBGA - Trays (Alt: AS4C128M16D2-25BIN) RoHS: Not Compliant Min Qty: 162 Package Multiple: 162 Lead time: 16 Weeks, 0 Days Container: Tray | 3663 Factory Stock |
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$15.3000 | Buy Now |
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DISTI #
AS4C128M16D2-25BIN
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Avnet Americas | DRAM Chip DDR2 SDRAM 2G-Bit 128M x 16 1.8V 84-Pin FBGA T/R - Tape and Reel (Alt: AS4C128M16D2-25BIN) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$15.3900 | Buy Now |
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DISTI #
913-A4C128M16D225BIN
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Mouser Electronics | DRAM DDR2, 2G, 128M x 16, 1.8V, 400 Mhz, 84ball FBGA, Industrial Temp - Tray RoHS: Compliant | 224 |
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$10.6100 / $11.0400 | Buy Now |
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Future Electronics | AS4C128M Series 2Gb (128M x 16) 15 ns 1.9 V SMT DDR2 Memory - TFBGA-84 RoHS: Compliant pbFree: Yes Min Qty: 1620 Package Multiple: 162 Lead time: 16 Weeks Container: Tray | 0Tray |
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$10.4200 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR2 2G 128M x 16 1.8V 400 Mhz 84ball FBGA Industrial Temp | 6255 |
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RFQ | |
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DISTI #
AS4C128M16D2-25BIN
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Avnet Silica | DRAM Chip DDR2 SDRAM 2G-Bit 128M x 16 1.8V 84-Pin FBGA (Alt: AS4C128M16D2-25BIN) RoHS: Compliant Min Qty: 162 Package Multiple: 162 Lead time: 17 Weeks, 0 Days | Silica - 162 |
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Buy Now | |
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Chip1Cloud | IC DRAM 2GBIT PARALLEL 84FBGA | 3650 |
|
RFQ | |
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New Advantage Corporation | FBGA 84/I�/128M x 16 bit DDRII Synchronous DRAM (SDRAM) RoHS: Compliant Min Qty: 1 Package Multiple: 162 | 187 |
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$16.3700 / $17.7000 | Buy Now |
Part Details for AS4C128M16D2-25BIN
AS4C128M16D2-25BIN CAD Models
AS4C128M16D2-25BIN Part Data Attributes
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AS4C128M16D2-25BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C128M16D2-25BIN
Alliance Memory Inc
DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-84 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 13.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.095 A | |
| Supply Current-Max | 0.36 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10.5 mm |
Alternate Parts for AS4C128M16D2-25BIN
This table gives cross-reference parts and alternative options found for AS4C128M16D2-25BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS4C128M16D2-25BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS4C128M16D2-25BCN | DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA84, HALOGEN FREE AND ROHS COMPLIANT, FBGA-84 | Alliance Memory Inc | AS4C128M16D2-25BIN vs AS4C128M16D2-25BCN |