Part Details for APF19-19-13CB by CTS Corporation
Overview of APF19-19-13CB by CTS Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HIP1013CBZA | Renesas Electronics Corporation | Low Cost Dual Power Distribution Controller, SOICN, /Tube | |
| R7S910013CBG#AC0 | Renesas Electronics Corporation | Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip | |
| HIP1013CB-T | Renesas Electronics Corporation | Low Cost Dual Power Distribution Controller, SOICN, /Reel |
Price & Stock for APF19-19-13CB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
294-1149-ND
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DigiKey | HEATSINK LOW-PROFILE FORGED Lead time: 14 Weeks Container: Box | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
APF19-19-13CB
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Avnet Americas | Heat Sink Passive 4.4?C/W 6063 Aluminum Alloy Black Anodized SMD BGA - Bulk (Alt: APF19-19-13CB) RoHS: Not Compliant Min Qty: 100 Package Multiple: 100 Container: Bulk | 0 |
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RFQ |
Part Details for APF19-19-13CB
APF19-19-13CB CAD Models
APF19-19-13CB Part Data Attributes
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APF19-19-13CB
CTS Corporation
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Datasheet
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APF19-19-13CB
CTS Corporation
HEATSINK LOW-PROFILE FORGED
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | CTS CORP | |
| Reach Compliance Code | unknown | |
| Body Material | ALUMINUM ALLOY | |
| Color | BLACK | |
| Device Used On | IC | |
| Finish | ANODIZED | |
| Height | 12.7 mm | |
| Length | 19 mm | |
| Profile | ADHESIVE | |
| Thermal Resistance | 15.6 Ω | |
| Thermal Support Device Type | HEAT SINK | |
| Width | 19 mm |