Part Details for APA150-FGG256A by Microsemi Corporation
Overview of APA150-FGG256A by Microsemi Corporation
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Applications
Energy and Power Systems
Renewable Energy
Automotive
Part Details for APA150-FGG256A
APA150-FGG256A CAD Models
APA150-FGG256A Part Data Attributes
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APA150-FGG256A
Microsemi Corporation
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Datasheet
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APA150-FGG256A
Microsemi Corporation
Field Programmable Gate Array, 6144-Cell, CMOS, PBGA256,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B256 | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 186 | |
| Number of Logic Cells | 6144 | |
| Number of Outputs | 186 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |