Datasheets
AOT1608L by: Alpha & Omega Semiconductor

Transistor

Part Details for AOT1608L by Alpha & Omega Semiconductor

Results Overview of AOT1608L by Alpha & Omega Semiconductor

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

AOT1608L Information

AOT1608L by Alpha & Omega Semiconductor is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for AOT1608L

Part # Distributor Description Stock Price Buy
DISTI # 785-1412-5-ND
DigiKey MOSFET N-CH 60V 11A/140A TO220 Min Qty: 1000 Lead time: 18 Weeks Container: Tube Limited Supply - Call
  • 1,000 $0.6857
$0.6857 Buy Now
DISTI # AOT1608L
TME Transistor: N-MOSFET, unipolar, 60V, 100A, 166W, TO220 Min Qty: 1 158
  • 1 $1.2300
  • 5 $1.1000
  • 25 $0.9700
  • 100 $0.8800
  • 500 $0.8100
$0.8100 / $1.2300 Buy Now

Part Details for AOT1608L

AOT1608L CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

AOT1608L Part Data Attributes

AOT1608L Alpha & Omega Semiconductor
Buy Now Datasheet
Compare Parts:
AOT1608L Alpha & Omega Semiconductor Transistor
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ALPHA & OMEGA SEMICONDUCTOR LTD
Package Description TO-220, 3 PIN
Reach Compliance Code compliant
ECCN Code EAR99
Samacsys Manufacturer Alpha & Omega Semiconductors
Avalanche Energy Rating (Eas) 638 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 11 A
Drain-source On Resistance-Max 0.0076 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 80 pF
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 333 W
Pulsed Drain Current-Max (IDM) 256 A
Surface Mount NO
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON

AOT1608L Related Parts

AOT1608L Frequently Asked Questions (FAQ)

  • The maximum junction temperature (Tj) that the AOT1608L can withstand is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation and to prevent thermal runaway.

  • To ensure the AOT1608L is properly biased, make sure to provide a stable input voltage (Vin) within the recommended range (4.5V to 30V), and a stable gate-source voltage (Vgs) within the recommended range (-2V to 10V). Also, ensure the drain-source voltage (Vds) is within the recommended range (0V to 30V).

  • For optimal thermal management, it's recommended to use a PCB with a thermal pad and a heat sink. The thermal pad should be connected to a copper plane on the PCB to dissipate heat efficiently. Also, ensure good airflow around the device and avoid placing heat-sensitive components nearby.

  • Yes, the AOT1608L is suitable for high-frequency switching applications up to 1MHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the PCB layout and component selection are optimized for high-frequency operation.

  • To protect the AOT1608L from ESD, handle the device with anti-static wrist straps, mats, or bags. Ensure the PCB has ESD protection components, such as TVS diodes or ESD protection arrays, and follow proper ESD handling procedures during assembly and testing.