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RF and Microwave / RF/Microwave Frequency Multipliers / AMMP-6125-TR1G
Datasheets
AMMP-6125-TR1G by:
Broadcom Limited
Avago Technologies
Broadcom Limited
Not Found

Frequency Doubler, 10000MHz Min, 24000MHz Max, ROHS COMPLIANT PACKAGE-8

Part Details for AMMP-6125-TR1G by Broadcom Limited

Results Overview of AMMP-6125-TR1G by Broadcom Limited

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Applications Consumer Electronics Audio and Video Systems

AMMP-6125-TR1G Information

AMMP-6125-TR1G by Broadcom Limited is an RF/Microwave Frequency Multiplier.
RF/Microwave Frequency Multipliers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for AMMP-6125-TR1G

Part # Distributor Description Stock Price Buy
DISTI # AMMP-6125-TR1G
EBV Elektronik Frequency Multiplier 8 Pins SMD (Alt: AMMP-6125-TR1G) RoHS: Compliant Min Qty: 100 Package Multiple: 100 EBV - 0
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Part Details for AMMP-6125-TR1G

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AMMP-6125-TR1G Part Data Attributes

Parametric Data
AMMP-6125-TR1G Broadcom Limited
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Compare Parts:
AMMP-6125-TR1G Broadcom Limited Frequency Doubler, 10000MHz Min, 24000MHz Max, ROHS COMPLIANT PACKAGE-8
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer BROADCOM INC
Package Description LCC8,.2SQ,28
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Characteristic Impedance 50 Ω
Construction COMPONENT
Input Power-Max (CW) 10 dBm
Mounting Feature SURFACE MOUNT
Number of Terminals 8
Operating Frequency-Max 24000 MHz
Operating Frequency-Min 10000 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code LCC8,.2SQ,28
Power Supplies 3.5/5 V
RF/Microwave Device Type FREQUENCY DOUBLER
Surface Mount YES

Alternate Parts for AMMP-6125-TR1G

This table gives cross-reference parts and alternative options found for AMMP-6125-TR1G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AMMP-6125-TR1G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
AMMP-6125-TR2G Avago Technologies Check for Price 10000MHz - 24000MHz RF/MICROWAVE FREQUENCY DOUBLER, ROHS COMPLIANT PACKAGE-8 AMMP-6125-TR1G vs AMMP-6125-TR2G
Part Number Manufacturer Composite Price Description Compare
AMMP-6125-TR2G Broadcom Limited Check for Price Frequency Doubler, 10000MHz Min, 24000MHz Max, ROHS COMPLIANT PACKAGE-8 AMMP-6125-TR1G vs AMMP-6125-TR2G
AMMP-6125-BLKG Broadcom Limited Check for Price Frequency Doubler, 10000MHz Min, 24000MHz Max, ROHS COMPLIANT PACKAGE-8 AMMP-6125-TR1G vs AMMP-6125-BLKG
AMMP-6125-TR1G Avago Technologies Check for Price 10000MHz - 24000MHz RF/MICROWAVE FREQUENCY DOUBLER, ROHS COMPLIANT PACKAGE-8 AMMP-6125-TR1G vs AMMP-6125-TR1G
AMMP-6125-BLKG Avago Technologies Check for Price 10000MHz - 24000MHz RF/MICROWAVE FREQUENCY DOUBLER, ROHS COMPLIANT PACKAGE-8 AMMP-6125-TR1G vs AMMP-6125-BLKG

AMMP-6125-TR1G Related Parts

AMMP-6125-TR1G Frequently Asked Questions (FAQ)

  • Broadcom recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.

  • Use a low-dropout regulator (LDO) with a high power supply rejection ratio (PSRR) to minimize noise and ripple. Ensure the power supply can provide the required current and voltage (1.2V, 1.8V, and 3.3V) with minimal voltage droop.

  • Use controlled impedance traces, and ensure signal lines are routed away from noise sources. Implement signal termination and use differential pairs for high-speed signals. Also, consider using a signal integrity analysis tool to optimize the design.

  • Use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), and ensure the clock signal is properly routed and terminated. Consider using a clock distribution network to minimize skew and jitter.

  • Use a reliable boot loader that can handle the device's boot modes (e.g., UART, SPI, or I2C). Ensure the firmware is optimized for the device's architecture and memory constraints. Implement a secure boot mechanism to prevent unauthorized access.