Part Details for AM9702AL-2HDC by Msis Semiconductor Inc
Overview of AM9702AL-2HDC by Msis Semiconductor Inc
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Part Details for AM9702AL-2HDC
AM9702AL-2HDC CAD Models
AM9702AL-2HDC Part Data Attributes
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AM9702AL-2HDC
Msis Semiconductor Inc
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Datasheet
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AM9702AL-2HDC
Msis Semiconductor Inc
Memory IC, 256X8, MOS, CDIP24
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MSIS SEMICONDUCTOR INC | |
| Package Description | DIP, DIP24,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 650 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDIP-T24 | |
| JESD-609 Code | e0 | |
| Memory Density | 2048 bit | |
| Memory Width | 8 | |
| Number of Terminals | 24 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |