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Sitara processor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN 324-NFBGA -40 to 90
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
AM3357BZCZD60 by Texas Instruments is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-35868-5-ND
|
DigiKey | IC MPU SITARA 600MHZ 324NFBGA Min Qty: 1 Lead time: 18 Weeks Container: Tube |
135 In Stock |
|
$13.3351 / $20.4900 | Buy Now |
DISTI #
595-AM3357BZCZD60
|
Mouser Electronics | Microprocessors - MPU ARM Cortex-A8 MPU RoHS: Compliant | 657 |
|
$13.1000 / $22.3200 | Buy Now |
|
Win Source Electronics | Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs) | IC MPU SITARA 600MHZ 324NFBGA | 2700 |
|
$14.0777 / $21.1165 | Buy Now |
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AM3357BZCZD60
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
AM3357BZCZD60
Texas Instruments
Sitara processor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN 324-NFBGA -40 to 90
Select a part to compare: |
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | NFBGA-324 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Address Bus Width | 28 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 26 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 64 | |
Number of Terminals | 324 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 90 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (words) | 131072 | |
Seated Height-Max | 1.4 mm | |
Speed | 600 MHz | |
Supply Current-Max | 400 mA | |
Supply Voltage-Max | 1.144 V | |
Supply Voltage-Min | 1.056 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |