Part Details for AM2864BE-200DC by AMD
Overview of AM2864BE-200DC by AMD
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- Part Data Attributes: (Available)
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Part Details for AM2864BE-200DC
AM2864BE-200DC CAD Models
AM2864BE-200DC Part Data Attributes:
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AM2864BE-200DC
AMD
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Datasheet
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AM2864BE-200DC
AMD
EEPROM, 8KX8, 200ns, Parallel, NMOS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 200 ns | |
| Command User Interface | NO | |
| Data Polling | YES | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 35.56 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Page Size | 32 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 4.445 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Toggle Bit | NO | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |