Part Details for AM2864AE-300LEB by AMD
Overview of AM2864AE-300LEB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for AM2864AE-300LEB
AM2864AE-300LEB CAD Models
AM2864AE-300LEB Part Data Attributes
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AM2864AE-300LEB
AMD
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Datasheet
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AM2864AE-300LEB
AMD
EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | QFJ | |
| Package Description | QCCN, LCC32,.45X.55 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 300 ns | |
| Command User Interface | NO | |
| Data Polling | YES | |
| JESD-30 Code | R-CQCC-N32 | |
| JESD-609 Code | e0 | |
| Length | 13.97 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Page Size | 32 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | NMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Toggle Bit | NO | |
| Width | 11.43 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for AM2864AE-300LEB
This table gives cross-reference parts and alternative options found for AM2864AE-300LEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2864AE-300LEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM2864BE-300LIB | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864BE-300LIB |
| X28C64ET1 | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | AM2864AE-300LEB vs X28C64ET1 |
| P5C164300L32MB | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Pyramid Semiconductor Corporation | AM2864AE-300LEB vs P5C164300L32MB |
| X2864AE | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | AM2864AE-300LEB vs X2864AE |
| AM2864A-30LCB | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864A-30LCB |
| AM2864A-30LEB | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864A-30LEB |
| AM2864A-30LI | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864A-30LI |
| AM2864AE-300LC | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864AE-300LC |
| AM2864B-30LE | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864B-30LE |
| AM2864A-3LCB | EEPROM, 8KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM2864AE-300LEB vs AM2864A-3LCB |