Datasheets
AM27S33APC by:

OTP ROM, 1KX4, 35ns, Bipolar, PDIP18, PLASTIC, DIP-18

Part Details for AM27S33APC by AMD

Overview of AM27S33APC by AMD

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for AM27S33APC

Part # Distributor Description Stock Price Buy
Bristol Electronics   21
RFQ
Bristol Electronics   4
RFQ
Quest Components PROM, 1K x 4, 18 Pin, Plastic, DIP 119
  • 1 $20.5800
  • 55 $17.4930
  • 115 $16.4640
$16.4640 / $20.5800 Buy Now
Quest Components PROM, 1K x 4, 18 Pin, Plastic, DIP 7
  • 1 $15.0000
  • 3 $11.0000
  • 8 $10.0000
$10.0000 / $15.0000 Buy Now
Quest Components PROM, 1K x 4, 18 Pin, Plastic, DIP 1
  • 1 $15.0000
  • 2 $10.0000
$10.0000 / $15.0000 Buy Now
ComSIT USA 1K X 4 OTPROM OTP ROM, 1KX4, 35ns, Bipolar, PDIP18 RoHS: Not Compliant Stock EU - 353
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ

Part Details for AM27S33APC

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AM27S33APC Part Data Attributes

AM27S33APC AMD
Buy Now Datasheet
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AM27S33APC AMD OTP ROM, 1KX4, 35ns, Bipolar, PDIP18, PLASTIC, DIP-18
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 120 ns
JESD-30 Code R-PDIP-T18
JESD-609 Code e0
Length 22.987 mm
Memory Density 262144 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 18
Number of Words 1024 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27S33APC

This table gives cross-reference parts and alternative options found for AM27S33APC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S33APC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DM74S573BJ 1KX4 OTPROM, 35ns, CDIP18, CERAMIC, DIP-18 Texas Instruments AM27S33APC vs DM74S573BJ
AM27S32ADC OTP ROM, 1KX4, 35ns, Bipolar, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 AMD AM27S33APC vs AM27S32ADC
DM74S573BN IC 1K X 4 OTPROM, 35 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM Texas Instruments AM27S33APC vs DM74S573BN
AM27S32APC OTP ROM, 1KX4, 35ns, Bipolar, PDIP18, PLASTIC, DIP-18 AMD AM27S33APC vs AM27S32APC
AM27S33ADCB OTP ROM, 1KX4, 35ns, Bipolar, CDIP18, CERAMIC, DIP-18 AMD AM27S33APC vs AM27S33ADCB
63S441ANXXXX OTP ROM, 1KX4, 35ns, CMOS, PDIP18, Monolithic Memories (RETIRED) AM27S33APC vs 63S441ANXXXX
63S441AN OTP ROM, 1KX4, 35ns, CMOS, PDIP18, Monolithic Memories (RETIRED) AM27S33APC vs 63S441AN
AM27S33ADC OTP ROM, 1KX4, 35ns, Bipolar, CDIP18, CERAMIC, DIP-18 AMD AM27S33APC vs AM27S33ADC
AM27S33APCB OTP ROM, 1KX4, 35ns, Bipolar, PDIP18, PLASTIC, DIP-18 AMD AM27S33APC vs AM27S33APCB
63S441AJ OTP ROM, 1KX4, 35ns, CMOS, CDIP18, Monolithic Memories (RETIRED) AM27S33APC vs 63S441AJ
Part Number Description Manufacturer Compare
AM27S32/BYA OTP ROM, 1KX4, 70ns, Bipolar, CDFP18, CERAMIC, FP-18 AMD AM27S33APC vs AM27S32/BYA
TBP24SA41N 1KX4 OTPROM, 60ns, PDIP18, 0.300 INCH, DIP-18 Texas Instruments AM27S33APC vs TBP24SA41N
M54741AS OTP ROM, 1KX4, 50ns, Bipolar, CDIP18, METAL SEALED, CERAMIC, DIP-18 Mitsubishi Electric AM27S33APC vs M54741AS
53S440W883B OTP ROM, 1KX4, 55ns, CMOS, CDFP18, Monolithic Memories (RETIRED) AM27S33APC vs 53S440W883B
AM27S33A/BYA OTP ROM, 1KX4, 45ns, Bipolar, CDFP18, CERAMIC, FP-18 AMD AM27S33APC vs AM27S33A/BYA
TBP24S41N 1KX4 OTPROM, 60ns, PDIP18, 0.300 INCH, DIP-18 Texas Instruments AM27S33APC vs TBP24S41N
82S137A/BYA IC 1K X 4 OTPROM, 55 ns, CDFP18, CERAMIC, FP-18, Programmable ROM NXP Semiconductors AM27S33APC vs 82S137A/BYA
DM74S573BN IC 1K X 4 OTPROM, 35 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM Texas Instruments AM27S33APC vs DM74S573BN
53S440J OTP ROM, 1KX4, 55ns, CMOS, CDIP18, Monolithic Memories (RETIRED) AM27S33APC vs 53S440J
M54740AS-2 OTP ROM, 1KX4, 35ns, Bipolar, CDIP18, METAL SEALED, CERAMIC, DIP-18 Mitsubishi Electric AM27S33APC vs M54740AS-2

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