Part Details for AM27S25SAPCB by AMD
Overview of AM27S25SAPCB by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for AM27S25SAPCB
AM27S25SAPCB CAD Models
AM27S25SAPCB Part Data Attributes
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AM27S25SAPCB
AMD
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Datasheet
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AM27S25SAPCB
AMD
OTP ROM, 512X8, 12ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP24,.3 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 31.242 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 512 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for AM27S25SAPCB
This table gives cross-reference parts and alternative options found for AM27S25SAPCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S25SAPCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S25APC | OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27S25SAPCB vs AM27S25APC |
| 5962-8851807LA | OTP ROM, 512X8, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | AM27S25SAPCB vs 5962-8851807LA |
| AM27S25SAPC | OTP ROM, 512X8, 12ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27S25SAPCB vs AM27S25SAPC |
| 5962-8851804LA | OTP ROM, 512X8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | AM27S25SAPCB vs 5962-8851804LA |
| CY7C225A-30DMB | OTP ROM, 512X8, 15ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 | Cypress Semiconductor | AM27S25SAPCB vs CY7C225A-30DMB |
| CY7C225-30DMB | OTP ROM, 512X8, 20ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | Cypress Semiconductor | AM27S25SAPCB vs CY7C225-30DMB |
| AM27S25/BLA | OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Rochester Electronics LLC | AM27S25SAPCB vs AM27S25/BLA |
| AM27S25A/BLA | OTP ROM, | Cypress Semiconductor | AM27S25SAPCB vs AM27S25A/BLA |
| 5962-8851804LA | OTP ROM, 512X8, 20ns, CMOS, CDIP24, | Teledyne e2v | AM27S25SAPCB vs 5962-8851804LA |
| AM27S25APCB | OTP ROM, 512X8, 20ns, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | AMD | AM27S25SAPCB vs AM27S25APCB |