Datasheets
AM27LS18DC by: AMD

OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16

Part Details for AM27LS18DC by AMD

Overview of AM27LS18DC by AMD

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Part Details for AM27LS18DC

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AM27LS18DC Part Data Attributes:

AM27LS18DC AMD
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AM27LS18DC AMD OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns
JESD-30 Code R-CDIP-T16
JESD-609 Code e0
Length 19.431 mm
Memory Density 524288 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 64000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics OPEN-COLLECTOR
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27LS18DC

This table gives cross-reference parts and alternative options found for AM27LS18DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS18DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27LS18DCB OTP ROM, 32X8, 55ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 AMD AM27LS18DC vs AM27LS18DCB
AM27LS18PCB OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD AM27LS18DC vs AM27LS18PCB
AM27LS19DC OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS18DC vs AM27LS19DC
Part Number Description Manufacturer Compare
DM74S288AN 32X8 OTPROM, 25ns, PDIP16, PLASTIC, DIP-16 Texas Instruments AM27LS18DC vs DM74S288AN
82S23A/BEA IC 32 X 8 OTPROM, 35 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors AM27LS18DC vs 82S23A/BEA
DM74S188J 32X8 OTPROM, 35ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27LS18DC vs DM74S188J
AM27LS19/BEA OTP ROM, 32X8, 70ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS18DC vs AM27LS19/BEA
AM27LS19DC OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS18DC vs AM27LS19DC
82S23A/BEA OTP ROM, 32X8, 35ns, Bipolar, CDIP16, YAGEO Corporation AM27LS18DC vs 82S23A/BEA
IDM29750NC IC 32 X 8 OTPROM, 30 ns, PDIP16, PLASTIC, DIP-16, Programmable ROM National Semiconductor Corporation AM27LS18DC vs IDM29750NC
82S123B/BEA IC 32 X 8 OTPROM, 30 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM NXP Semiconductors AM27LS18DC vs 82S123B/BEA
N82S23N IC 32 X 8 OTPROM, 50 ns, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Programmable ROM NXP Semiconductors AM27LS18DC vs N82S23N
63S081AN OTP ROM, 32X8, 15ns, CMOS, PDIP16, Monolithic Memories (RETIRED) AM27LS18DC vs 63S081AN

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