Datasheets
AM27C080-100DC by: AMD

UVPROM, 1MX8, 100ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32

Part Details for AM27C080-100DC by AMD

Overview of AM27C080-100DC by AMD

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for AM27C080-100DC

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AM27C080-100DC Part Data Attributes:

AM27C080-100DC AMD
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AM27C080-100DC AMD UVPROM, 1MX8, 100ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
JESD-609 Code e0
Length 42.1005 mm
Memory Density 8388608 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27C080-100DC

This table gives cross-reference parts and alternative options found for AM27C080-100DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C080-100DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C801-120F1 1MX8 UVPROM, 120ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics AM27C080-100DC vs M27C801-120F1
M27C801-100F1 1MX8 UVPROM, 100ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics AM27C080-100DC vs M27C801-100F1
Part Number Description Manufacturer Compare
KM23V8000D MASK ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor AM27C080-100DC vs KM23V8000D
UPD23C8001ECZ MASK ROM, 1MX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32 NEC Electronics America Inc AM27C080-100DC vs UPD23C8001ECZ
M27C801-60B6TR 1MX8 OTPROM, 60ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics AM27C080-100DC vs M27C801-60B6TR
AM27C080-200PC OTP ROM, 1MX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD AM27C080-100DC vs AM27C080-200PC
M27C801-70F1 1MX8 UVPROM, 70ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics AM27C080-100DC vs M27C801-70F1
AM27C080-120PI OTP ROM, 1MX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD AM27C080-100DC vs AM27C080-120PI
AT27LV080-20DC UVPROM, 1MX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation AM27C080-100DC vs AT27LV080-20DC
M27C801-200F6 1MX8 UVPROM, 200ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics AM27C080-100DC vs M27C801-200F6
AT27C080-12PI OTP ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation AM27C080-100DC vs AT27C080-12PI
HN62338BP-12 1M X 8 MASK PROM, 120 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Renesas Electronics Corporation AM27C080-100DC vs HN62338BP-12

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