Part Details for AM2632COMFHAZCZR by Texas Instruments
Overview of AM2632COMFHAZCZR by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for AM2632COMFHAZCZR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-AM2632COMFHAZCZRCT-ND
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DigiKey | IC MCU 32BIT 256KB TCM 324LFBGA Min Qty: 1 Lead time: 12 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
1000 In Stock |
|
$15.9044 / $23.6100 | Buy Now |
|
DISTI #
595-AM2632COMFHAZCZR
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Mouser Electronics | ARM Microcontrollers - MCU Dual-core Arm Cortex -R5F MCU up to 400 MHz with real-time control and security RoHS: Compliant | 0 |
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$15.9000 | Order Now |
|
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Ameya Holding Limited | 1029 |
|
RFQ |
Part Details for AM2632COMFHAZCZR
AM2632COMFHAZCZR CAD Models
AM2632COMFHAZCZR Part Data Attributes:
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AM2632COMFHAZCZR
Texas Instruments
Buy Now
Datasheet
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AM2632COMFHAZCZR
Texas Instruments
Dual-core Arm® Cortex®-R5F MCU up to 400 MHz with real-time control and security 324-NFBGA -40 to 105
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | NFBGA-324 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | 256KBYTES TCM MEMORY ALSO AVAILABLE | |
| Clock Frequency-Max | 400 MHz | |
| JESD-30 Code | S-PBGA-B324 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |