Datasheets
AFT09H310-03SR6 by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

RF POWER, FET

Part Details for AFT09H310-03SR6 by NXP Semiconductors

Results Overview of AFT09H310-03SR6 by NXP Semiconductors

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AFT09H310-03SR6 Information

AFT09H310-03SR6 by NXP Semiconductors is an RF Power Field-Effect Transistor.
RF Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for AFT09H310-03SR6

Part # Distributor Description Stock Price Buy
DISTI # 85AK8057
Newark Airfast Rf Power Ldmos Transistor, 920-960 Mhz, 56 W Avg., 28 V/Reel Rohs Compliant: Yes |Nxp AFT09H... 310-03SR6 more RoHS: Compliant Min Qty: 150 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $148.6300
$148.6300 Buy Now
Rochester Electronics AFT09H310 - Airfast RF Power LDMOS Transistor, 920-960 MHz, 56 W Avg., 28 V RoHS: Compliant Status: Obsolete Min Qty: 1 309
  • 1 $173.3300
  • 25 $169.8600
  • 100 $162.9300
  • 500 $156.0000
  • 1,000 $147.3300
$147.3300 / $173.3300 Buy Now
DISTI # AFT09H310-03SR6
Avnet Silica Transistor RF FET NCH 70V 920MHz to 960MHz 3Pin NI1230S TR (Alt: AFT09H310-03SR6) RoHS: Compliant Min Qty: 150 Package Multiple: 150 Silica - 0
Buy Now
DISTI # AFT09H310-03SR6
EBV Elektronik Transistor RF FET NCH 70V 920MHz to 960MHz 3Pin NI1230S TR (Alt: AFT09H310-03SR6) RoHS: Compliant Min Qty: 150 Package Multiple: 150 EBV - 0
Buy Now

Part Details for AFT09H310-03SR6

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AFT09H310-03SR6 Part Data Attributes

AFT09H310-03SR6 NXP Semiconductors
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AFT09H310-03SR6 NXP Semiconductors RF POWER, FET
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.29.00
Samacsys Manufacturer NXP
Case Connection SOURCE
Configuration SEPARATE, 2 ELEMENTS
FET Technology METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Number of Elements 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 225 °C
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Time@Peak Reflow Temperature-Max (s) 40

Alternate Parts for AFT09H310-03SR6

This table gives cross-reference parts and alternative options found for AFT09H310-03SR6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AFT09H310-03SR6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MRF8P9300HR6 NXP Semiconductors Check for Price 2 CHANNEL, UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET AFT09H310-03SR6 vs MRF8P9300HR6
MRF8P9300HSR6 Freescale Semiconductor Check for Price Single W-CDMA Lateral N-Channel RF Power MOSFET, 920-960 MHz, 100 W Avg., 28 V AFT09H310-03SR6 vs MRF8P9300HSR6

AFT09H310-03SR6 Related Parts

AFT09H310-03SR6 Frequently Asked Questions (FAQ)

  • For optimal performance, it's recommended to follow NXP's guidelines for PCB layout and thermal management. Ensure a solid ground plane, use thermal vias, and keep the component away from heat sources. A minimum of 2oz copper thickness is recommended for the PCB.

  • To ensure EMC, follow NXP's guidelines for PCB layout, use a shielded enclosure, and ensure proper grounding. Additionally, use EMI filters and shielding on cables, and consider using a common-mode choke to reduce emissions.

  • NXP provides reliability data in the datasheet, but for specific MTBF expectations, consult NXP's reliability reports or contact their support team. MTBF is typically calculated based on operating conditions, temperature, and other factors.

  • The AFT09H310-03SR6 is rated for operation up to 150°C. However, derating may be necessary for high-temperature applications. Consult NXP's application notes and thermal management guidelines for specific guidance.

  • Follow NXP's recommended soldering and rework procedures, which typically include using a soldering iron with a temperature range of 220-240°C, and a solder with a melting point above 217°C. Avoid using excessive force or bending the leads during rework.