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Fully Integrated, 8-Channel Ultrasound Analog Front End 135-NFBGA 0 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AFE5803ZCF | Texas Instruments | Fully Integrated, 8-Channel Ultrasound Analog Front End 135-NFBGA 0 to 85 |
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-36553-ND
|
DigiKey | IC AFE 8 CHAN 14BIT 135NFBGA Min Qty: 160 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
|
$67.6808 | Buy Now |
DISTI #
595-AFE5803ZCF
|
Mouser Electronics | Analog Front End - AFE Fully Int,8Ch Ultra sound AFE RoHS: Compliant | 160 |
|
$67.1400 / $78.8600 | Buy Now |
|
Rochester Electronics | AFE5803 Fully Integrated, 8-Channel Ultrasound Analog Front End RoHS: Compliant Status: Active Min Qty: 1 | 2 |
|
$62.4600 / $73.4800 | Buy Now |
DISTI #
C1S746202898763
|
Chip1Stop | AFE General Purpose 8ADC 14bit 1.8V/3.3V/5V 135-Pin BGA Tray RoHS: Compliant pbFree: Yes | 320 |
|
$66.6000 | Buy Now |
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AFE5803ZCF
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
AFE5803ZCF
Texas Instruments
Fully Integrated, 8-Channel Ultrasound Analog Front End 135-NFBGA 0 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | 15 X 9 MM, GREEN, PLASTIC, NFBGA-135 | |
Pin Count | 135 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Additional Feature | IT ALSO REQUIRES 3.15 & 4.75 V FOR NORMAL OPERATION | |
Analog IC - Other Type | ANALOG CIRCUIT | |
JESD-30 Code | R-PBGA-B135 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Moisture Sensitivity Level | 3 | |
Number of Channels | 8 | |
Number of Functions | 1 | |
Number of Terminals | 135 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.72 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm |