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Part Details for ADSP-CM408CSWZ-BF by Analog Devices Inc
Results Overview of ADSP-CM408CSWZ-BF by Analog Devices Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADSP-CM408CSWZ-BF Information
ADSP-CM408CSWZ-BF by Analog Devices Inc is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ADSP-2105BPZ-80RL | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2105BPZ-80 | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2101BPZ-100 | Rochester Electronics LLC | ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) |
Price & Stock for ADSP-CM408CSWZ-BF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
ADSP-CM408CSWZ-BF-ND
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DigiKey | IC ARM CORTEX M4 FLASH 176LQFP Min Qty: 1 Lead time: 20 Weeks Container: Tray |
35 In Stock |
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$19.9000 / $23.9500 | Buy Now |
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Analog Devices Inc | ARM CORTEX M4 FLASH, 13+ ENOB Package Multiple: 40 | 7 |
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$15.9200 / $23.9500 | Buy Now |
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DISTI #
ADSPCM408CSWZBF
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Richardson RFPD | DIGITAL SIGNAL PROCESSOR IC RoHS: Compliant Min Qty: 40 | 0 |
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$20.8200 / $22.2500 | Buy Now |
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Flip Electronics | Stock, ship today | 20 |
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RFQ | |
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LCSC | LQFP-176(24x24) Digital Signal Processors (DSP/DSC) ROHS | 20 |
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$28.7826 / $30.1636 | Buy Now |
Part Details for ADSP-CM408CSWZ-BF
ADSP-CM408CSWZ-BF CAD Models
ADSP-CM408CSWZ-BF Part Data Attributes
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ADSP-CM408CSWZ-BF
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-CM408CSWZ-BF
Analog Devices Inc
240MHz ARM Cortex-M4 with 13+ ENOB ADC, LQFP176
Select a part to compare: |
| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | LQFP-176 | |
| Pin Count | 176 | |
| Manufacturer Package Code | SW-176-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | 24 | |
| Barrel Shifter | NO | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 60 MHz | |
| External Data Bus Width | 16 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PQFP-G176 | |
| Length | 24 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 17 | |
| Number of External Interrupts | 6 | |
| Number of Serial I/Os | 5 | |
| Number of Terminals | 176 | |
| Number of Timers | 11 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HLFQFP | |
| Package Equivalence Code | HQFP176,1.0SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 393216 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 24 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
Alternate Parts for ADSP-CM408CSWZ-BF
This table gives cross-reference parts and alternative options found for ADSP-CM408CSWZ-BF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADSP-CM408CSWZ-BF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| ADSP-CM408CSWZ-AF | Analog Devices Inc | $35.9280 | 240MHz ARM Cortex-M4 with 13+ ENOB ADC, LQFP176 | ADSP-CM408CSWZ-BF vs ADSP-CM408CSWZ-AF |
| ADSP-CM407CSWZ-BF | Analog Devices Inc | $34.3873 | 240MHz ARM Cortex-M4 with 11+ ENOB ADC, LQFP176 | ADSP-CM408CSWZ-BF vs ADSP-CM407CSWZ-BF |
| ADSP-CM407CSWZ-AF | Analog Devices Inc | Check for Price | 240MHz ARM Cortex-M4 with 11+ ENOB ADC, LQFP176 | ADSP-CM408CSWZ-BF vs ADSP-CM407CSWZ-AF |
ADSP-CM408CSWZ-BF Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP and VDDMEM. This ensures proper power-up and minimizes the risk of latch-up or other damage.
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Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory hierarchy, and optimizing the software implementation to minimize memory accesses and maximize parallel processing.
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The ADSP-CM408CSWZ-BF has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, ensure good airflow, and avoid blocking airflow around the device. A thermal interface material can be used to improve heat transfer between the device and the heat sink.
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To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Additionally, ensure that the system's power supply is designed to minimize electromagnetic interference (EMI).
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In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the device is properly packaged and sealed to prevent moisture ingress. Use conformal coating and potting compounds as needed to protect the device from environmental stressors.