Part Details for ADSP-BF532SBBC400 by Analog Devices Inc
Results Overview of ADSP-BF532SBBC400 by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADSP-BF532SBBC400 Information
ADSP-BF532SBBC400 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ADSP-2105BPZ-80 | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2101BPZ-100 | Rochester Electronics LLC | ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
| ADSP-2101BG-100 | Rochester Electronics LLC | ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) |
Price & Stock for ADSP-BF532SBBC400
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 137 |
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RFQ | ||
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Bristol Electronics | 28 |
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RFQ | ||
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Quest Components | 56 |
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$21.9912 / $25.8720 | Buy Now | |
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Rochester Electronics | BLACKFIN Embedded Processor RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 5643 |
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$15.3900 / $18.1100 | Buy Now |
Part Details for ADSP-BF532SBBC400
ADSP-BF532SBBC400 CAD Models
ADSP-BF532SBBC400 Part Data Attributes
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ADSP-BF532SBBC400
Analog Devices Inc
Buy Now
Datasheet
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ADSP-BF532SBBC400
Analog Devices Inc
400 MHz High Performance Blackfin Processor
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | BGA | |
| Package Description | MO-205AE, CSBGA-160 | |
| Pin Count | 160 | |
| Manufacturer Package Code | BC-160-2 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 3V OR 3.3V SUPPLY | |
| Address Bus Width | 19 | |
| Barrel Shifter | YES | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 16 | |
| Format | FIXED POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B160 | |
| JESD-609 Code | e0 | |
| Length | 12 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 160 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA160,14X14,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 1.45 V | |
| Supply Voltage-Min | 0.8 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
ADSP-BF532SBBC400 Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
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Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory, and optimizing the code for the specific application.
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The ADSP-BF532SBBC400 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, ensure good airflow, and avoid overheating the device.
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To ensure EMC, follow proper PCB design guidelines, use shielding and filtering, and ensure that the system meets the relevant EMC standards and regulations.
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In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the system is designed to withstand these conditions, and consider using conformal coating, sealing, or other protection methods as needed.