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Low Power Blackfin with Consumer Devices Connectivity
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADSP-BF512KSWZ-4 by Analog Devices Inc is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ADSP-2105BPZ-80RL | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
ADSP-2105BPZ-80 | Rochester Electronics LLC | ADSP-2105 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) | |
ADSP-2101BPZ-100 | Rochester Electronics LLC | ADSP-2101 - 16-Bit Fixed-Point DSP Microprocessor (-40C to + 85C) |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
ADSP-BF512KSWZ-4-ND
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DigiKey | IC DSP 16/32B 400MHZ LP 176LQFP Min Qty: 1 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
|
$15.2407 / $22.7600 | Buy Now |
DISTI #
584-ADSP-BF512KSWZ-4
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Low-Power Blackfin Processor RoHS: Compliant | 0 |
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$14.7300 / $25.8200 | Order Now |
|
Analog Devices Inc | Low-Power Blackfin Processor Package Multiple: 40 | 0 |
|
$11.7900 / $22.7600 | Buy Now |
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Bristol Electronics | 28 |
|
RFQ | ||
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Quest Components | 22 |
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$22.6598 / $25.1776 | Buy Now |
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ADSP-BF512KSWZ-4
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
ADSP-BF512KSWZ-4
Analog Devices Inc
Low Power Blackfin with Consumer Devices Connectivity
Select a part to compare: |
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | QFP | |
Package Description | LQFP-176 | |
Pin Count | 176 | |
Manufacturer Package Code | SQ-176-2 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Address Bus Width | 19 | |
Barrel Shifter | YES | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 400 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PQFP-G176 | |
Length | 24 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 176 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP176,1.0SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Speed | 400 MHz | |
Supply Voltage-Max | 1.47 V | |
Supply Voltage-Min | 1.164 V | |
Supply Voltage-Nom | 1.4 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 24 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
This table gives cross-reference parts and alternative options found for ADSP-BF512KSWZ-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ADSP-BF512KSWZ-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
ADSP-BF512KBCZ-4F4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Consumer Devices Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF512KBCZ-4F4 |
ADSP-BF516KBCZ-4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF516KBCZ-4 |
ADSP-BF514KSWZ-4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Consumer Devices Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF514KSWZ-4 |
ADSP-BF512BBCZ-4 | Analog Devices Inc | $16.0201 | Low Power Blackfin with Consumer Devices Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF512BBCZ-4 |
ADSP-BF516BSWZ-4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF516BSWZ-4 |
ADSP-BF516BSWZ-4F4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF516BSWZ-4F4 |
ADSP-BF518BSWZ-4F4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF518BSWZ-4F4 |
ADSP-BF518BBCZ-4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF518BBCZ-4 |
ADSP-BF516BBCZ-4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF516BBCZ-4 |
ADSP-BF518BBCZ-4F4 | Analog Devices Inc | Check for Price | Low Power Blackfin with Advanced Embedded Connectivity | ADSP-BF512KSWZ-4 vs ADSP-BF518BBCZ-4F4 |
The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory, and optimizing the code using the compiler's optimization flags.
The ADSP-BF512KSWZ-4 has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, consider using thermal interface materials to improve heat transfer.
To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Also, ensure that the device is properly decoupled and that the power supply is well-regulated.
In harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the device is properly packaged and sealed, and consider using conformal coating or potting to protect the device from environmental stressors.