Part Details for ADN2892ACPZ-RL by Analog Devices Inc
Results Overview of ADN2892ACPZ-RL by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ADN2892ACPZ-RL Information
ADN2892ACPZ-RL by Analog Devices Inc is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for ADN2892ACPZ-RL
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Vyrian | Telecommunications | 258 |
|
RFQ |
Part Details for ADN2892ACPZ-RL
ADN2892ACPZ-RL CAD Models
ADN2892ACPZ-RL Part Data Attributes
|
ADN2892ACPZ-RL
Analog Devices Inc
Buy Now
Datasheet
|
Compare Parts:
ADN2892ACPZ-RL
Analog Devices Inc
3.3 V 4.25 Gb/s Limiting Amplifier
Select a part to compare: |
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | QFN | |
Package Description | HVQCCN, LCC16,.12SQ,20 | |
Pin Count | 16 | |
Manufacturer Package Code | CP-16-3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
JESD-30 Code | S-XQCC-N16 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC16,.12SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.9 mm | |
Supply Current-Max | 0.054 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 3 mm |
ADN2892ACPZ-RL Frequently Asked Questions (FAQ)
-
A good PCB layout for the ADN2892ACPZ-RL involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, it's essential to follow the layout guidelines provided in the datasheet and application notes.
-
To ensure proper biasing, make sure to follow the recommended voltage supply and biasing circuitry outlined in the datasheet. The device requires a single 3.3V or 5V power supply, and the bias voltage (VBIAS) should be set to 1.2V to 1.5V. Additionally, ensure that the input common-mode voltage is within the recommended range.
-
The ADN2892ACPZ-RL can support data rates up to 12.5 Gbps, but the actual data rate achievable depends on the specific application, PCB layout, and signal integrity. It's essential to follow the recommended layout and signal integrity guidelines to achieve the highest possible data rate.
-
To troubleshoot issues with the ADN2892ACPZ-RL, start by verifying the PCB layout and signal integrity. Check for signal reflections, crosstalk, and electromagnetic interference (EMI). Use oscilloscopes and signal analyzers to measure signal quality and jitter. Consult the datasheet and application notes for guidance on troubleshooting and debugging techniques.
-
The ADN2892ACPZ-RL is rated for operation up to 85°C, but it can be used in high-temperature applications with proper thermal management. Ensure that the device is properly heatsinked, and the PCB is designed to dissipate heat effectively. Consult the datasheet and application notes for guidance on thermal management and high-temperature operation.