Datasheets
ADM6996MX-AD-T-1 by:
Infineon Technologies AG
Infineon Technologies AG
Intel Corporation
Lantiq
Not Found

LAN Controller, 7 Channel(s), 12.5MBps, CMOS, PQFP128, GREEN, PLASTIC, QFP-128

Part Details for ADM6996MX-AD-T-1 by Infineon Technologies AG

Results Overview of ADM6996MX-AD-T-1 by Infineon Technologies AG

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ADM6996MX-AD-T-1 Information

ADM6996MX-AD-T-1 by Infineon Technologies AG is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for ADM6996MX-AD-T-1

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ADM6996MX-AD-T-1 Part Data Attributes

ADM6996MX-AD-T-1 Infineon Technologies AG
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ADM6996MX-AD-T-1 Infineon Technologies AG LAN Controller, 7 Channel(s), 12.5MBps, CMOS, PQFP128, GREEN, PLASTIC, QFP-128
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code QFP
Package Description GREEN, PLASTIC, QFP-128
Pin Count 128
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Boundary Scan NO
Clock Frequency-Max 25 MHz
Data Encoding/Decoding Method NRZ; NRZI
Data Transfer Rate-Max 12.5 MBps
JESD-30 Code R-PQFP-G128
JESD-609 Code e3
Length 20 mm
Low Power Mode YES
Number of Serial I/Os 7
Number of Terminals 128
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Shape RECTANGULAR
Package Style FLATPACK, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 3.4 mm
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN

ADM6996MX-AD-T-1 Related Parts

ADM6996MX-AD-T-1 Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.

  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.

  • The recommended soldering conditions for the ADM6996MX-AD-T-1 involve using a soldering iron with a temperature of 260°C (500°F) for a maximum of 10 seconds. It's also essential to follow the recommended soldering profile and to avoid overheating the device.

  • To troubleshoot issues with the device's output voltage, check the input voltage, output load, and PCB layout for any anomalies. Verify that the device is properly configured and that the output voltage is within the specified range. If issues persist, consult the datasheet or contact Infineon's technical support.

  • The ADM6996MX-AD-T-1 has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent ESD damage. Use ESD-safe materials, handle the device by the body, and avoid touching the pins or leads.