Part Details for ADM6996MX-AD-T-1 by Infineon Technologies AG
Results Overview of ADM6996MX-AD-T-1 by Infineon Technologies AG
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ADM6996MX-AD-T-1 Information
ADM6996MX-AD-T-1 by Infineon Technologies AG is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for ADM6996MX-AD-T-1
ADM6996MX-AD-T-1 CAD Models
ADM6996MX-AD-T-1 Part Data Attributes
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ADM6996MX-AD-T-1
Infineon Technologies AG
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Datasheet
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ADM6996MX-AD-T-1
Infineon Technologies AG
LAN Controller, 7 Channel(s), 12.5MBps, CMOS, PQFP128, GREEN, PLASTIC, QFP-128
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Part Package Code | QFP | |
Package Description | GREEN, PLASTIC, QFP-128 | |
Pin Count | 128 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Boundary Scan | NO | |
Clock Frequency-Max | 25 MHz | |
Data Encoding/Decoding Method | NRZ; NRZI | |
Data Transfer Rate-Max | 12.5 MBps | |
JESD-30 Code | R-PQFP-G128 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | 7 | |
Number of Terminals | 128 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.4 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
ADM6996MX-AD-T-1 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to ensure that the device is operated within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
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The recommended soldering conditions for the ADM6996MX-AD-T-1 involve using a soldering iron with a temperature of 260°C (500°F) for a maximum of 10 seconds. It's also essential to follow the recommended soldering profile and to avoid overheating the device.
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To troubleshoot issues with the device's output voltage, check the input voltage, output load, and PCB layout for any anomalies. Verify that the device is properly configured and that the output voltage is within the specified range. If issues persist, consult the datasheet or contact Infineon's technical support.
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The ADM6996MX-AD-T-1 has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent ESD damage. Use ESD-safe materials, handle the device by the body, and avoid touching the pins or leads.