Part Details for ADC1613S065HN-C1 by Integrated Device Technology Inc
Overview of ADC1613S065HN-C1 by Integrated Device Technology Inc
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Part Details for ADC1613S065HN-C1
ADC1613S065HN-C1 CAD Models
ADC1613S065HN-C1 Part Data Attributes
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ADC1613S065HN-C1
Integrated Device Technology Inc
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Datasheet
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ADC1613S065HN-C1
Integrated Device Technology Inc
VFQFPN-32, Tray
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | VFQFPN | |
| Package Description | 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 | |
| Pin Count | 32 | |
| Manufacturer Package Code | NDG32 | |
| Reach Compliance Code | compliant | |
| Analog Input Voltage-Max | 2 V | |
| Converter Type | ADC, PROPRIETARY METHOD | |
| JESD-30 Code | S-PQCC-N32 | |
| JESD-609 Code | e1 | |
| Linearity Error-Max (EL) | 0.0076% | |
| Number of Bits | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Bit Code | OFFSET BINARY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Supplies | 1.8,3 V | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |