Datasheets
AD5311RBRMZ by: Analog Devices Inc

10-Bit nanoDAC, I<sup>2</sup>C Interface and 2 ppm/&deg;C On-Chip Reference

Part Details for AD5311RBRMZ by Analog Devices Inc

Results Overview of AD5311RBRMZ by Analog Devices Inc

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AD5311RBRMZ Information

AD5311RBRMZ by Analog Devices Inc is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for AD5311RBRMZ

Part # Distributor Description Stock Price Buy
DISTI # 505-AD5311RBRMZ-ND
DigiKey IC DAC 10BIT V-OUT 10MSOP Min Qty: 1 Lead time: 10 Weeks Container: Tube 96
In Stock
  • 1 $3.7600
  • 10 $2.8360
  • 50 $2.4656
  • 100 $2.3510
  • 250 $2.2299
  • 500 $2.1569
  • 1,000 $2.0969
  • 2,500 $2.0335
  • 5,000 $1.9953
$1.9953 / $3.7600 Buy Now
DISTI # 584-AD5311RBRMZ
Mouser Electronics Digital to Analog Converters - DAC 10-Bit nanoDAC, I2C Interface and 2 ppm/ C On-Chip Reference RoHS: Compliant 274
  • 1 $5.1700
  • 10 $3.3800
  • 50 $2.6100
  • 250 $2.5300
  • 500 $1.9500
  • 1,000 $1.8600
$1.8600 / $5.1700 Buy Now

Part Details for AD5311RBRMZ

AD5311RBRMZ CAD Models

AD5311RBRMZ Part Data Attributes

AD5311RBRMZ Analog Devices Inc
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AD5311RBRMZ Analog Devices Inc 10-Bit nanoDAC, I<sup>2</sup>C Interface and 2 ppm/&deg;C On-Chip Reference
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Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Package Description MSOP-10
Pin Count 10
Manufacturer Package Code RM-10
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Analog Devices
Analog Output Voltage-Max 5.005 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code S-PDSO-G10
JESD-609 Code e3
Length 3 mm
Linearity Error-Max (EL) 0.0488%
Moisture Sensitivity Level 1
Number of Bits 10
Number of Functions 1
Number of Terminals 10
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Shape SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Settling Time-Nom (tstl) 5 µs
Supply Voltage-Nom 3 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

AD5311RBRMZ Related Parts

AD5311RBRMZ Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the AD5311RBRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources to minimize noise. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane and to avoid running digital signals under the device.

  • To ensure accurate voltage reference performance with the AD5311RBRMZ, it's essential to decouple the VREF pin with a 10nF capacitor to GND, use a low-noise power supply, and minimize noise on the VCC pin. Additionally, the device should be operated within the recommended temperature range and voltage supply range.

  • The recommended calibration procedure for the AD5311RBRMZ involves applying a known input voltage, measuring the output code, and adjusting the offset and gain trim bits to achieve the desired accuracy. The device should be calibrated at multiple temperatures and voltage supply levels to ensure optimal performance.

  • The AD5311RBRMZ's digital output data should be handled by using a first-in, first-out (FIFO) buffer to store the output data, and then transferring the data to a microcontroller or other digital system for processing. It's essential to ensure that the digital system can handle the data rate and format of the AD5311RBRMZ.

  • The AD5311RBRMZ has a maximum junction temperature of 150°C, and it's essential to ensure that the device is operated within this temperature range. Thermal management considerations include using a heat sink, ensuring good airflow, and minimizing power dissipation in the device.