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10-Bit nanoDAC, I<sup>2</sup>C Interface and 2 ppm/°C On-Chip Reference
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
AD5311RBRMZ by Analog Devices Inc is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.
A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
505-AD5311RBRMZ-ND
|
DigiKey | IC DAC 10BIT V-OUT 10MSOP Min Qty: 1 Lead time: 10 Weeks Container: Tube |
96 In Stock |
|
$1.9953 / $3.7600 | Buy Now |
DISTI #
584-AD5311RBRMZ
|
Mouser Electronics | Digital to Analog Converters - DAC 10-Bit nanoDAC, I2C Interface and 2 ppm/ C On-Chip Reference RoHS: Compliant | 274 |
|
$1.8600 / $5.1700 | Buy Now |
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AD5311RBRMZ
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
AD5311RBRMZ
Analog Devices Inc
10-Bit nanoDAC, I<sup>2</sup>C Interface and 2 ppm/°C On-Chip Reference
Select a part to compare: |
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Package Description | MSOP-10 | |
Pin Count | 10 | |
Manufacturer Package Code | RM-10 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Analog Output Voltage-Max | 5.005 V | |
Analog Output Voltage-Min | ||
Converter Type | D/A CONVERTER | |
Input Bit Code | BINARY | |
Input Format | SERIAL | |
JESD-30 Code | S-PDSO-G10 | |
JESD-609 Code | e3 | |
Length | 3 mm | |
Linearity Error-Max (EL) | 0.0488% | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 10 | |
Number of Functions | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.1 mm | |
Settling Time-Nom (tstl) | 5 µs | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3 mm |
The recommended layout and placement for the AD5311RBRMZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources to minimize noise. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane and to avoid running digital signals under the device.
To ensure accurate voltage reference performance with the AD5311RBRMZ, it's essential to decouple the VREF pin with a 10nF capacitor to GND, use a low-noise power supply, and minimize noise on the VCC pin. Additionally, the device should be operated within the recommended temperature range and voltage supply range.
The recommended calibration procedure for the AD5311RBRMZ involves applying a known input voltage, measuring the output code, and adjusting the offset and gain trim bits to achieve the desired accuracy. The device should be calibrated at multiple temperatures and voltage supply levels to ensure optimal performance.
The AD5311RBRMZ's digital output data should be handled by using a first-in, first-out (FIFO) buffer to store the output data, and then transferring the data to a microcontroller or other digital system for processing. It's essential to ensure that the digital system can handle the data rate and format of the AD5311RBRMZ.
The AD5311RBRMZ has a maximum junction temperature of 150°C, and it's essential to ensure that the device is operated within this temperature range. Thermal management considerations include using a heat sink, ensuring good airflow, and minimizing power dissipation in the device.