Part Details for AD14060LBF-4 by Analog Devices Inc
Overview of AD14060LBF-4 by Analog Devices Inc
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Applications
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Internet of Things (IoT)
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Part Details for AD14060LBF-4
AD14060LBF-4 CAD Models
AD14060LBF-4 Part Data Attributes:
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AD14060LBF-4
Analog Devices Inc
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AD14060LBF-4
Analog Devices Inc
480-MFLOP, Quad DSP, 3.3v, CQFP Package
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Pbfree Code | Yes | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | QFP | |
Package Description | CERAMIC, QFP-308 | |
Pin Count | 308 | |
Manufacturer Package Code | QS-308 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Analog Devices | |
Address Bus Width | 32 | |
Barrel Shifter | YES | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 40 MHz | |
External Data Bus Width | 48 | |
Format | FLOATING POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-CQFP-F308 | |
JESD-609 Code | e4 | |
Length | 52.07 mm | |
Low Power Mode | NO | |
Number of Terminals | 308 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | GQFF | |
Package Equivalence Code | TPAK308,3.0SQ,25 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, GUARD RING | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (words) | 524288 | |
Seated Height-Max | 4.064 mm | |
Supply Current-Max | 2120 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.15 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Gold (Au) | |
Terminal Form | FLAT | |
Terminal Pitch | 0.635 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 52.07 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |