Part Details for A2I25H060GNR1 by NXP Semiconductors
Overview of A2I25H060GNR1 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Electronic Manufacturing
Automotive
Price & Stock for A2I25H060GNR1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8093
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Newark | Airfast Rf Ldmos Wideband Integrated Power Amplifier, 2300-2690 Mhz, 10.5 W Avg., 28 V/Reel Rohs Compliant: Yes |Nxp A2I25H060GNR1 Min Qty: 500 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$24.7800 | Buy Now |
|
Chip1Cloud | IC TRANS RF LDMOS | 1330 |
|
RFQ |
Part Details for A2I25H060GNR1
A2I25H060GNR1 CAD Models
A2I25H060GNR1 Part Data Attributes:
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A2I25H060GNR1
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
A2I25H060GNR1
NXP Semiconductors
IC TRANS RF LDMOS
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TO-270WBG-17 | |
Reach Compliance Code | not_compliant | |
Factory Lead Time | 26 Weeks | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | R-PDSO-G17 | |
JESD-609 Code | e3 | |
Length | 17.53 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 17 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.67 mm | |
Supply Voltage-Nom | 28 V | |
Surface Mount | YES | |
Technology | LDMOS | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 9.02 mm |