ZPSD513B1-12LI
Description: IC,FIELD PGM PERIPH,CMOS,LDCC,68PIN,CERAMIC

Overview of ZPSD513B1-12LI by STMicroelectronics

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  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Consumer Electronics Education and Research Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Computing and Data Storage Healthcare Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Electronic Manufacturing Communication and Networking Robotics and Drones

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Part Data Attributes for ZPSD513B1-12LI by STMicroelectronics

ZPSD513B1-12LI
STMicroelectronics
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
Reach Compliance Code
not_compliant
HTS Code
8542.31.00.01
JESD-30 Code
S-XQCC-J68
JESD-609 Code
e0
Number of Terminals
68
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC
Package Code
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Qualification Status
Not Qualified
Supply Voltage-Nom
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
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  1. ZPSD513B1-12LI
    STMicroelectronics
    IC,FIELD PGM PERIPH,CMOS,LDCC,68PIN,CERAMIC
    VS

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