Datasheets
ZL30250LDF1 by:

Microprocessor Circuit, CMOS, QFN-32

Part Details for ZL30250LDF1 by Microsemi Corporation

Overview of ZL30250LDF1 by Microsemi Corporation

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Part Details for ZL30250LDF1

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ZL30250LDF1 Part Data Attributes

ZL30250LDF1 Microsemi Corporation
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ZL30250LDF1 Microsemi Corporation Microprocessor Circuit, CMOS, QFN-32
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description QFN-32
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-XQCC-N32
Number of Terminals 32
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code QCCN
Package Shape SQUARE
Package Style CHIP CARRIER
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Position QUAD
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

Alternate Parts for ZL30250LDF1

This table gives cross-reference parts and alternative options found for ZL30250LDF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ZL30250LDF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
ZL30250LDG1 Microprocessor Circuit, CMOS, QFN-32 Microsemi Corporation ZL30250LDF1 vs ZL30250LDG1
Part Number Description Manufacturer Compare
ZL30250LDF1 Microprocessor Circuit, CMOS Microchip Technology Inc ZL30250LDF1 vs ZL30250LDF1
ZL30250LDG1 Microprocessor Circuit, CMOS, QFN-32 Microsemi Corporation ZL30250LDF1 vs ZL30250LDG1

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