Part Details for ZGR323LAS2008G by IXYS Corporation
Overview of ZGR323LAS2008G by IXYS Corporation
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Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for ZGR323LAS2008G
ZGR323LAS2008G CAD Models
ZGR323LAS2008G Part Data Attributes
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ZGR323LAS2008G
IXYS Corporation
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ZGR323LAS2008G
IXYS Corporation
Microcontroller, 8-Bit, OTPROM, Z8 CPU, 8MHz, CMOS, PDSO20, LEAD FREE, SOIC-20
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | IXYS CORP | |
Part Package Code | SOIC | |
Package Description | LEAD FREE, SOIC-20 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | ||
Bit Size | 8 | |
CPU Family | Z8 | |
Clock Frequency-Max | 8 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3 | |
Length | 12.775 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 16 | |
Number of Terminals | 20 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP20,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 255 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 237 | |
ROM (words) | 8192 | |
ROM Programmability | OTPROM | |
Seated Height-Max | 2.65 mm | |
Speed | 8 MHz | |
Supply Current-Max | 5 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 7.5 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |