Part Details for XPC860DECZP50D4 by Freescale Semiconductor
Overview of XPC860DECZP50D4 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860DECZP50D4
XPC860DECZP50D4 CAD Models
XPC860DECZP50D4 Part Data Attributes
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XPC860DECZP50D4
Freescale Semiconductor
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Datasheet
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XPC860DECZP50D4
Freescale Semiconductor
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA357,19X19,50 | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A991 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860DECZP50D4
This table gives cross-reference parts and alternative options found for XPC860DECZP50D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860DECZP50D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC860SRMZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860DECZP50D4 vs TSPC860SRMZPU50B |
| XPC860DTZP50D3 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860DECZP50D4 vs XPC860DTZP50D3 |
| XPC860DPZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860DECZP50D4 vs XPC860DPZP50D4 |
| XPC857TZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860DECZP50D4 vs XPC857TZP50B |
| TSPC860SRMZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860DECZP50D4 vs TSPC860SRMZPU50B |
| MPC860DECZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | XPC860DECZP50D4 vs MPC860DECZQ50D4 |
| XPC862TZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860DECZP50D4 vs XPC862TZP50B |
| XPC860TZP50D3 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860DECZP50D4 vs XPC860TZP50D3 |
| XPC860DPZP50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860DECZP50D4 vs XPC860DPZP50D4R2 |
| KMPC860SRZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860DECZP50D4 vs KMPC860SRZQ50D4 |