Part Details for XPC8260ZUIFBC by Rochester Electronics LLC
Overview of XPC8260ZUIFBC by Rochester Electronics LLC
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Part Details for XPC8260ZUIFBC
XPC8260ZUIFBC CAD Models
XPC8260ZUIFBC Part Data Attributes
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XPC8260ZUIFBC
Rochester Electronics LLC
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XPC8260ZUIFBC
Rochester Electronics LLC
32-BIT, 200MHz, RISC PROCESSOR, PBGA480, 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | |
| Pin Count | 480 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66.66 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B480 | |
| JESD-609 Code | e0 | |
| Length | 37.5 mm | |
| Low Power Mode | NO | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 480 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.65 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 37.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |