Datasheets
XCZU15EG-L1FFVC900I by:

Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900

Part Details for XCZU15EG-L1FFVC900I by AMD Xilinx

Overview of XCZU15EG-L1FFVC900I by AMD Xilinx

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Part Details for XCZU15EG-L1FFVC900I

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XCZU15EG-L1FFVC900I Part Data Attributes

XCZU15EG-L1FFVC900I AMD Xilinx
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XCZU15EG-L1FFVC900I AMD Xilinx Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Number of Terminals 900
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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