Part Details for XCV400-6FGG676I by AMD Xilinx
Overview of XCV400-6FGG676I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for XCV400-6FGG676I
XCV400-6FGG676I CAD Models
XCV400-6FGG676I Part Data Attributes
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XCV400-6FGG676I
AMD Xilinx
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Datasheet
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XCV400-6FGG676I
AMD Xilinx
Field Programmable Gate Array, 2400 CLBs, 468252 Gates, 333MHz, CMOS, PBGA676, FBGA-676
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 333 MHz | |
| Combinatorial Delay of a CLB-Max | 0.6 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2400 | |
| Number of Equivalent Gates | 468252 | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2400 CLBS, 468252 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
Alternate Parts for XCV400-6FGG676I
This table gives cross-reference parts and alternative options found for XCV400-6FGG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCV400-6FGG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCV400-6FG676C | Field Programmable Gate Array, 2400 CLBs, 468252 Gates, 333MHz, 10800-Cell, CMOS, PBGA676, FBGA-676 | AMD Xilinx | XCV400-6FGG676I vs XCV400-6FG676C |
| XCV400-6FG676I | Field Programmable Gate Array, 2400 CLBs, 468252 Gates, 333MHz, 10800-Cell, CMOS, PBGA676, FBGA-676 | AMD Xilinx | XCV400-6FGG676I vs XCV400-6FG676I |
| XCV400-6FGG676C | Field Programmable Gate Array, 2400 CLBs, 468252 Gates, 333MHz, CMOS, PBGA676, FBGA-676 | AMD Xilinx | XCV400-6FGG676I vs XCV400-6FGG676C |