Part Details for XCV200E-6FGG256C by AMD Xilinx
Overview of XCV200E-6FGG256C by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for XCV200E-6FGG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 21 |
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RFQ |
Part Details for XCV200E-6FGG256C
XCV200E-6FGG256C CAD Models
XCV200E-6FGG256C Part Data Attributes
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XCV200E-6FGG256C
AMD Xilinx
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Datasheet
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XCV200E-6FGG256C
AMD Xilinx
Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA256, FBGA-256
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 357 MHz | |
| Combinatorial Delay of a CLB-Max | 0.47 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1176 | |
| Number of Equivalent Gates | 63504 | |
| Number of Inputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Outputs | 176 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1176 CLBS, 63504 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XCV200E-6FGG256C
This table gives cross-reference parts and alternative options found for XCV200E-6FGG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCV200E-6FGG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XCV200E-6FG256C | Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA256, FBGA-256 | AMD Xilinx | XCV200E-6FGG256C vs XCV200E-6FG256C |
| XCV200E-6FGG256I | Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA256, FBGA-256 | AMD Xilinx | XCV200E-6FGG256C vs XCV200E-6FGG256I |