Datasheets
XCR3384XL-7FGG324C by:

EE PLD, 7.5ns, 384-Cell, CMOS, PBGA324, FBGA-324

Part Details for XCR3384XL-7FGG324C by AMD

Overview of XCR3384XL-7FGG324C by AMD

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Part Details for XCR3384XL-7FGG324C

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XCR3384XL-7FGG324C Part Data Attributes

XCR3384XL-7FGG324C AMD
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XCR3384XL-7FGG324C AMD EE PLD, 7.5ns, 384-Cell, CMOS, PBGA324, FBGA-324
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FBGA-324
Reach Compliance Code compliant
Additional Feature YES
Clock Frequency-Max 135 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B324
JESD-609 Code e1
JTAG BST YES
Length 23 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 220
Number of Macro Cells 384
Number of Terminals 324
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 220 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,20X20,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type EE PLD
Propagation Delay 7.5 ns
Qualification Status Not Qualified
Seated Height-Max 2.5 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm

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