Part Details for XC7A15T-2CSG324C by AMD Xilinx
Overview of XC7A15T-2CSG324C by AMD Xilinx
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Computing and Data Storage
Telecommunications
Price & Stock for XC7A15T-2CSG324C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
57AJ5888
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Newark | Fpga, Artix-7, 210I/O, Csbga-324 Rohs Compliant: Yes |Amd Xilinx XC7A15T-2CSG324C Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 123 |
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$54.0800 | Buy Now |
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CHIPMALL.COM LIMITED | CSPBGA-324 Programmable Logic Device CPLDs/FPGAs ROHS | 129 |
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$22.8063 / $23.8727 | Buy Now |
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LCSC | CSPBGA-324 Programmable Logic Device (CPLDs/FPGAs) ROHS | 129 |
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$23.2717 / $24.3599 | Buy Now |
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MacroQuest Electronics | FPGA Artix-7 16640 Cells 28nm Technology 1V 324-Pin CS-BGA Tray | 1200 |
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$76.8400 / $99.6800 | Buy Now |
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Win Source Electronics | FPGA Artix-7 16640 Cells 28nm Technology 1V 324-Pin CS-BGA Tray | 5263 |
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$65.9420 / $81.1600 | Buy Now |
Part Details for XC7A15T-2CSG324C
XC7A15T-2CSG324C CAD Models
XC7A15T-2CSG324C Part Data Attributes:
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XC7A15T-2CSG324C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC7A15T-2CSG324C
AMD Xilinx
Field Programmable Gate Array, 1300 CLBs, PBGA324, BGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks | |
| Clock Frequency-Max | 1286 MHz | |
| Combinatorial Delay of a CLB-Max | 1.05 ns | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1300 | |
| Number of Inputs | 250 | |
| Number of Logic Cells | 16640 | |
| Number of Outputs | 250 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1300 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |