Part Details for XC73108-12BG225I by AMD Xilinx
Overview of XC73108-12BG225I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for XC73108-12BG225I
XC73108-12BG225I CAD Models
XC73108-12BG225I Part Data Attributes
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XC73108-12BG225I
AMD Xilinx
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Datasheet
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XC73108-12BG225I
AMD Xilinx
OT PLD, 30ns, 108-Cell, CMOS, PBGA225, PLASTIC, BGA-225
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-225 | |
| Pin Count | 225 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS | |
| Clock Frequency-Max | 55.6 MHz | |
| In-System Programmable | NO | |
| JESD-30 Code | S-PBGA-B225 | |
| JESD-609 Code | e0 | |
| JTAG BST | NO | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | 12 | |
| Number of I/O Lines | 78 | |
| Number of Macro Cells | 108 | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 12 DEDICATED INPUTS, 78 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA225,15X15 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | OT PLD | |
| Propagation Delay | 30 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
Alternate Parts for XC73108-12BG225I
This table gives cross-reference parts and alternative options found for XC73108-12BG225I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC73108-12BG225I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC73108-15WB225I | AMD Xilinx | Check for Price | UV PLD, 36ns, 108-Cell, CMOS, CBGA225, WINDOWED, CERAMIC, BGA-225 | XC73108-12BG225I vs XC73108-15WB225I |
| XC73108-15BG225C | AMD Xilinx | Check for Price | OT PLD, 36ns, 108-Cell, CMOS, PBGA225, PLASTIC, BGA-225 | XC73108-12BG225I vs XC73108-15BG225C |
| XC73108-20BG225C | AMD Xilinx | Check for Price | OT PLD, 45ns, 108-Cell, CMOS, PBGA225, PLASTIC, BGA-225 | XC73108-12BG225I vs XC73108-20BG225C |
| XC73108-10WB225C | AMD Xilinx | Check for Price | UV PLD, 25ns, 108-Cell, CMOS, CBGA225, WINDOWED, CERAMIC, BGA-225 | XC73108-12BG225I vs XC73108-10WB225C |