Part Details for XC5VLX50T-1FFG665C by AMD
Overview of XC5VLX50T-1FFG665C by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for XC5VLX50T-1FFG665C
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-1565-ND
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DigiKey | IC FPGA 360 I/O 665FCBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$924.3000 | Buy Now |
DISTI #
XC5VLX50T-1FFG665C
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Avnet Americas | FPGA Virtex-5 LXT Family 46080 Cells 65nm (CMOS) Technology 1V 665-Pin FCBGA - Trays (Alt: XC5VLX50T-1FFG665C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$899.4150 | Buy Now |
DISTI #
217-5VLX50T-1FFG665C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC5VLX50T-1FFG665C RoHS: Compliant | 3 |
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$924.2100 | Buy Now |
DISTI #
XC5VLX50T-1FFG665C
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Avnet Asia | FPGA Virtex-5 LXT Family 46080 Cells 65nm (CMOS) Technology 1V 665-Pin FCBGA (Alt: XC5VLX50T-1FFG665C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days | 0 |
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$836.4706 / $935.5263 | Buy Now |
Part Details for XC5VLX50T-1FFG665C
XC5VLX50T-1FFG665C CAD Models
XC5VLX50T-1FFG665C Part Data Attributes
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XC5VLX50T-1FFG665C
AMD
Buy Now
Datasheet
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Compare Parts:
XC5VLX50T-1FFG665C
AMD
Field Programmable Gate Array, 3600 CLBs, 46080-Cell, PBGA665, BGA-665
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | BGA-665 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | AMD | |
Combinatorial Delay of a CLB-Max | 0.9 ns | |
JESD-30 Code | S-PBGA-B665 | |
JESD-609 Code | e1 | |
Length | 27 mm | |
Moisture Sensitivity Level | 4 | |
Number of CLBs | 3600 | |
Number of Inputs | 360 | |
Number of Logic Cells | 46080 | |
Number of Outputs | 360 | |
Number of Terminals | 665 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 3600 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA665,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.9 mm | |
Supply Voltage-Max | 10.5 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm |