Part Details for XC3S4000-5FG456C by AMD
Overview of XC3S4000-5FG456C by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for XC3S4000-5FG456C
XC3S4000-5FG456C CAD Models
XC3S4000-5FG456C Part Data Attributes
|
|
XC3S4000-5FG456C
AMD
Buy Now
Datasheet
|
Compare Parts:
XC3S4000-5FG456C
AMD
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA456, FBGA-456
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-456 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 192 | |
| Number of Equivalent Gates | 50000 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 192 CLBS, 50000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |