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Overview of XC3S4000-4FGG456I by AMD
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XC3S4000-4FGG456I by AMD
Part Data Attributes for XC3S4000-4FGG456I by AMD
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
Package Description
|
LEAD FREE, FBGA-456
|
Reach Compliance Code
|
compliant
|
Clock Frequency-Max
|
630 MHz
|
Combinatorial Delay of a CLB-Max
|
0.61 ns
|
JESD-30 Code
|
S-PBGA-B456
|
JESD-609 Code
|
e1
|
Length
|
23 mm
|
Moisture Sensitivity Level
|
3
|
Number of CLBs
|
192
|
Number of Equivalent Gates
|
50000
|
Number of Inputs
|
333
|
Number of Outputs
|
333
|
Number of Terminals
|
456
|
Operating Temperature-Max
|
100 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
192 CLBS, 50000 GATES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
250
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.6 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
1.14 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
23 mm
|