Part Details for XC3S1200E-4FG320C by AMD Xilinx
Overview of XC3S1200E-4FG320C by AMD Xilinx
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Applications
Computing and Data Storage
Part Details for XC3S1200E-4FG320C
XC3S1200E-4FG320C CAD Models
XC3S1200E-4FG320C Part Data Attributes
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XC3S1200E-4FG320C
AMD Xilinx
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Datasheet
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XC3S1200E-4FG320C
AMD Xilinx
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA320, 19 X 19 MM, 2 MM HEIGHT, 1 MM PITCH, FBGA-320
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-320 | |
| Pin Count | 320 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Clock Frequency-Max | 572 MHz | |
| Combinatorial Delay of a CLB-Max | 0.76 ns | |
| JESD-30 Code | S-PBGA-B320 | |
| JESD-609 Code | e0 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2168 | |
| Number of Equivalent Gates | 1200000 | |
| Number of Inputs | 250 | |
| Number of Logic Cells | 19512 | |
| Number of Outputs | 194 | |
| Number of Terminals | 320 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2168 CLBS, 1200000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA320,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |