Part Details for XC2S100-6FG256C by AMD
Overview of XC2S100-6FG256C by AMD
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Part Details for XC2S100-6FG256C
XC2S100-6FG256C CAD Models
XC2S100-6FG256C Part Data Attributes
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XC2S100-6FG256C
AMD
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Datasheet
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XC2S100-6FG256C
AMD
Field Programmable Gate Array, 600 CLBs, 100000 Gates, 263MHz, 2700-Cell, PBGA256,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Reach Compliance Code | not_compliant | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 263 MHz | |
| Combinatorial Delay of a CLB-Max | 0.6 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 600 | |
| Number of Equivalent Gates | 100000 | |
| Number of Inputs | 180 | |
| Number of Logic Cells | 2700 | |
| Number of Outputs | 176 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 600 CLBS, 100000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |