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Overview of XA7A35T-1CSG325I by AMD Xilinx
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
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- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Security and Surveillance
Industrial Automation
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
CAD Models for XA7A35T-1CSG325I by AMD Xilinx
Part Data Attributes for XA7A35T-1CSG325I by AMD Xilinx
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Transferred
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Ihs Manufacturer
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XILINX INC
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Package Description
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15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-325
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.39.00.01
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Clock Frequency-Max
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1098 MHz
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Combinatorial Delay of a CLB-Max
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1.27 ns
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JESD-30 Code
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S-PBGA-B325
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JESD-609 Code
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e1
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Length
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15 mm
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Moisture Sensitivity Level
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3
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Number of CLBs
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2600
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Number of Inputs
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150
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Number of Logic Cells
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33280
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Number of Outputs
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150
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Number of Terminals
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325
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Operating Temperature-Max
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100 °C
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Operating Temperature-Min
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-40 °C
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Organization
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2600 CLBS
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LFBGA
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Package Equivalence Code
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BGA324,18X18,32
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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260
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Programmable Logic Type
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FIELD PROGRAMMABLE GATE ARRAY
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.5 mm
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Supply Voltage-Max
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1.05 V
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Supply Voltage-Min
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0.95 V
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Supply Voltage-Nom
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1 V
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Surface Mount
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YES
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Technology
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HKMG
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Terminal Finish
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TIN SILVER COPPER
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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15 mm
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