Part Details for X76F400WI-2.5 by IC Microsystems Sdn Bhd
Overview of X76F400WI-2.5 by IC Microsystems Sdn Bhd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for X76F400WI-2.5
X76F400WI-2.5 CAD Models
X76F400WI-2.5 Part Data Attributes
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X76F400WI-2.5
IC Microsystems Sdn Bhd
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Datasheet
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Compare Parts:
X76F400WI-2.5
IC Microsystems Sdn Bhd
Flash, 512X8, WAFER
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | IC MICROSYSTEMS SDN BHD | |
Part Package Code | WAFER | |
Package Description | DIE, | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Additional Feature | DATA RETENTION = 100 YEARS | |
Clock Frequency-Max (fCLK) | 1 MHz | |
Data Retention Time-Min | 100 | |
JESD-30 Code | X-XUUC-N | |
JESD-609 Code | e0 | |
Memory Density | 4096 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512X8 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Programming Voltage | 2.7 V | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Type | NOR TYPE | |
Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X76F400WI-2.5
This table gives cross-reference parts and alternative options found for X76F400WI-2.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X76F400WI-2.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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X76F400HG-2.5 | Flash, 512X8, ROHS COMPLIANT, DIE | IC Microsystems Sdn Bhd | X76F400WI-2.5 vs X76F400HG-2.5 |
X76F400WI-2.5 | Flash, 512X8, WAFER | Xicor Inc | X76F400WI-2.5 vs X76F400WI-2.5 |
X76F400HI-2.5 | Flash, 512X8, DIE | Xicor Inc | X76F400WI-2.5 vs X76F400HI-2.5 |
X76F400H-2.5 | Flash, 512X8, DIE | Xicor Inc | X76F400WI-2.5 vs X76F400H-2.5 |
X76F400W-2.5 | Flash, 512X8, WAFER | Xicor Inc | X76F400WI-2.5 vs X76F400W-2.5 |
X76F400HI-2.5 | Flash, 512X8, DIE | IC Microsystems Sdn Bhd | X76F400WI-2.5 vs X76F400HI-2.5 |
X76F400WG-2.5 | Flash, 512X8, ROHS COMPLIANT, WAFER | IC Microsystems Sdn Bhd | X76F400WI-2.5 vs X76F400WG-2.5 |
X76F400WIG-2.5 | Flash, 512X8, ROHS COMPLIANT, WAFER | IC Microsystems Sdn Bhd | X76F400WI-2.5 vs X76F400WIG-2.5 |