Datasheets
X76F400WI-2.5 by:

Flash, 512X8, WAFER

Part Details for X76F400WI-2.5 by IC Microsystems Sdn Bhd

Overview of X76F400WI-2.5 by IC Microsystems Sdn Bhd

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Part Details for X76F400WI-2.5

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X76F400WI-2.5 Part Data Attributes

X76F400WI-2.5 IC Microsystems Sdn Bhd
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X76F400WI-2.5 IC Microsystems Sdn Bhd Flash, 512X8, WAFER
Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer IC MICROSYSTEMS SDN BHD
Part Package Code WAFER
Package Description DIE,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature DATA RETENTION = 100 YEARS
Clock Frequency-Max (fCLK) 1 MHz
Data Retention Time-Min 100
JESD-30 Code X-XUUC-N
JESD-609 Code e0
Memory Density 4096 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Words 512 words
Number of Words Code 512
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512X8
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape UNSPECIFIED
Package Style UNCASED CHIP
Parallel/Serial SERIAL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Position UPPER
Type NOR TYPE
Write Cycle Time-Max (tWC) 10 ms

Alternate Parts for X76F400WI-2.5

This table gives cross-reference parts and alternative options found for X76F400WI-2.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X76F400WI-2.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
X76F400HG-2.5 Flash, 512X8, ROHS COMPLIANT, DIE IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400HG-2.5
X76F400WI-2.5 Flash, 512X8, WAFER Xicor Inc X76F400WI-2.5 vs X76F400WI-2.5
X76F400HI-2.5 Flash, 512X8, DIE Xicor Inc X76F400WI-2.5 vs X76F400HI-2.5
X76F400H-2.5 Flash, 512X8, DIE Xicor Inc X76F400WI-2.5 vs X76F400H-2.5
X76F400W-2.5 Flash, 512X8, WAFER Xicor Inc X76F400WI-2.5 vs X76F400W-2.5
X76F400HI-2.5 Flash, 512X8, DIE IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400HI-2.5
X76F400WG-2.5 Flash, 512X8, ROHS COMPLIANT, WAFER IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400WG-2.5
X76F400WIG-2.5 Flash, 512X8, ROHS COMPLIANT, WAFER IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400WIG-2.5
Part Number Description Manufacturer Compare
H1832CH MASK ROM, 512X8, 1330ns, CMOS Hughes Aircraft X76F400WI-2.5 vs H1832CH
X76F400H-2.5 Flash, 512X8, DIE Xicor Inc X76F400WI-2.5 vs X76F400H-2.5
X76F400HIG Flash, 512X8, ROHS COMPLIANT, DIE IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400HIG
AT24C04A-W1.8-11 EEPROM, 512X8, Serial Microchip Technology Inc X76F400WI-2.5 vs AT24C04A-W1.8-11
X76F400WIG-2.5 Flash, 512X8, ROHS COMPLIANT, WAFER IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F400WIG-2.5
X76F041HEG-3 Flash, 512X8, ROHS COMPLIANT, DIE IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F041HEG-3
X76F041W-3 Flash, 512X8, WAFER IC Microsystems Sdn Bhd X76F400WI-2.5 vs X76F041W-3
AT24C04-W2.7-11 EEPROM, 512X8, Serial, CMOS, DIE Atmel Corporation X76F400WI-2.5 vs AT24C04-W2.7-11
AT24C04SC-10WI EEPROM, 512X8, Serial, CMOS, WAFER Atmel Corporation X76F400WI-2.5 vs AT24C04SC-10WI
X76F400WI Flash, 512X8, WAFER Xicor Inc X76F400WI-2.5 vs X76F400WI

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