Part Details for X28C256GM-25 by Xicor Inc
Overview of X28C256GM-25 by Xicor Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for X28C256GM-25
X28C256GM-25 CAD Models
X28C256GM-25 Part Data Attributes
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X28C256GM-25
Xicor Inc
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Datasheet
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X28C256GM-25
Xicor Inc
EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | XICOR INC | |
Package Description | FRIT SEALED, CERAMIC, LCC-32 | |
Reach Compliance Code | unknown | |
Access Time-Max | 250 ns | |
Command User Interface | NO | |
Data Polling | YES | |
Endurance | 10000 Write/Erase Cycles | |
JESD-30 Code | R-GQCC-N32 | |
JESD-609 Code | e0 | |
Length | 13.97 mm | |
Memory Density | 262144 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | QCCN | |
Package Equivalence Code | LCC32,.45X.55 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Page Size | 64 words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.048 mm | |
Standby Current-Max | 0.0002 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Toggle Bit | YES | |
Width | 11.43 mm | |
Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X28C256GM-25
This table gives cross-reference parts and alternative options found for X28C256GM-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256GM-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AT28C256E-25LM/883 | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256GM-25 vs AT28C256E-25LM/883 |
5962-8852503YX | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256GM-25 vs 5962-8852503YX |
28C256-25I/K | 32K X 8 EEPROM 5V, 250 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | X28C256GM-25 vs 28C256-25I/K |
LM28C256-250/B | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32 | LSI Corporation | X28C256GM-25 vs LM28C256-250/B |
FT28C256-25LMB | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Force Technologies Ltd | X28C256GM-25 vs FT28C256-25LMB |
AM28C256-250LC | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256GM-25 vs AM28C256-250LC |
AM28C256LCB | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256GM-25 vs AM28C256LCB |
X28C256EI-25 | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM-25 vs X28C256EI-25 |
X28C256E-25 | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM-25 vs X28C256E-25 |
FT28C256E-25LMB | EEPROM, 32KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Force Technologies Ltd | X28C256GM-25 vs FT28C256E-25LMB |